As the HBM4 battle heats up this year, memory giants are ramping up HBM4E development, where custom HBM is expected to become one of the mainstreams. According to The Elec, Samsung’s custom HBM4E design is set to be completed by May–June 2026, with SK hynix and Micron on a similar timeline. T...

Intel and UMC are reportedly exploring a deeper partnership aimed at supporting AI-related applications. According to Economic Daily News, sources say Intel plans to license its proprietary “Super MIM” capacitor technology to UMC, a technology used in Intel’s next-generation angstrom-class pro...

Amid strong market expectations, Intel reported a fourth quarter slightly above forecasts. However, transcripts from Investing.com and Reuters note that the chipmaker’s growth is being limited by its own supply, as it is struggling to keep up with strong demand for its server processors used in AI...

China-based Cmsemicon launches its first non-volatile memory chip. It unveils its first Flash product, CMS25Q40A, which marks the company’s formal and substantive entry into the memory semiconductor sector. It’ s reported that the product is a 4M bit low-power SPI NOR Flash device. It feature...

As back-end processes take on a larger role in the AI chip era, advanced packaging equipment is rising in strategic importance. According to Hankyung, leading chip equipment makers—including ASML, Applied Materials, Tokyo Electron (TEL), and Lam Research—are moving decisively into the advanced p...