SK hynix announced on September 3 that it has installed a High NA EUV lithography system at its M16 fab in Icheon, South Korea, and held a ceremony to mark the system’s assembly. The machine introduced is ASML’s TWINSCAN EXE:5200B, the first High NA EUV model designed for volume production, a...

Hot on the heels of similar moves against Samsung and SK hynix, Washington has now targeted TSMC—informing the chipmaker it will revoke the Nanjing fab’s “validated end user” (VEU) status by December 31, 2025, Bloomberg reported, citing a company statement. As Central News Agency explains...

On August 27, San’an announced on its investor relations platform that the 8-inch silicon carbide (SiC) chip production line at its Hunan Sanan Semiconductor base has officially come online. It took less than a year for Hunan San’an’s 8-inch SiC chip line to go from construction to operatio...

Shortly after announcing its plan to close the Yokohama Plant, Nikon seems to double down its efforts on advanced node related chipmaking tools. According to Nikkan Shimbun, the Japanese semiconductor equipment firm aims to double sales of its wafer alignment stations—which measure wafer distortio...

According to PCMag, citing ZDNet, sources say Samsung may unveil a tri-fold smartphone, the Project Moohan XR headset, and AI smart glasses at an Unpacked event in South Korea, possibly on September 29. Rumors of a tri-fold phone, and the Project Moohan headset, developed with Google and Qualcom...