[News] Intel Begins Equipment Installation at Arizona Fab 62, Targeting 2028 Operations; Ohio One Advances

Intel is advancing its U.S. semiconductor manufacturing expansion, with equipment installation underway at Arizona’s Fab 62 and construction progressing at its Ohio One complex. According to Tom’s Hardware, Intel announced Wednesday that production equipment installation has begun at Fab 62, with mass production targeted for late 2028.

Fab 62 could support its 18A, 18A-P, and 14A nodes, the report notes. While neighboring Fab 52 already manufactures Intel 18A chips, the new facility could expand 18A capacity or support the next-generation 14A node. Intel has yet to confirm which nodes Fab 62 will produce, the report adds.

Ohio One Construction Advances as Intel Weighs Future Demand

At Intel’s Ohio One complex in New Albany, workers recently installed the first major structural truss for the site’s first semiconductor fab. According to The Next Web, Intel pushed back the facility’s opening to 2030–2031 last year. CEO Lip-Bu Tan, who took office in March 2025, has emphasized that projects such as Ohio One will proceed only when sufficient customer demand is secured, suggesting the latest construction milestone may reflect growing confidence in future demand.

Meanwhile, CNBC reports that Intel is reportedly in talks with SK hynix about potentially leasing part of its Ohio facility for memory chip production in the U.S., although neither company has confirmed the plans.

High-NA EUV and Advanced Manufacturing Capabilities

Beyond fab construction, Intel has integrated High-NA EUV lithography into high-volume manufacturing (HVM). According to Tom’s Hardware, Intel was the first chipmaker to install a commercial High-NA EUV scanner at its D1X facility in Oregon, subsequently incorporating the technology into manufacturing for Panther Lake and other chips.

Intel’s advanced packaging operations also span several states. Oregon leads R&D for advanced logic and 3D interconnects, Arizona handles packaging R&D, assembly, and testing, while New Mexico manufactures multi-chiplet processors using EMIB, next-generation EMIB-T, and Foveros technologies.

The company has also broken ground on a new photomask manufacturing facility in Santa Clara, California, further strengthening its domestic semiconductor supply chain. According to Tom’s Hardware, Intel works with more than 4,500 suppliers across 49 U.S. states, with annual domestic spending exceeding US$29 billion.

Read more

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(Photo credit: Lip-Bu Tan on X)