Monthly Archives: January 2026

[News] Leather Tycoon Eyes Hong Kong–Based Wide-Bandgap Hub, Moves to Acquire Power Chip Firm

Posted on 2026-01-12 by TrendForce

China International Development Corporation Limited (CIDC), a leather apparel-focused company, and Bowei Limited, a wholly owned subsidiary of LONTEN Semiconductor, signed a strategic cooperation memorandum of understanding on January 6, 2026, announcing plans to jointly establish an advanced power semiconductor …

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[News] China’s Iluvatar CoreX Reportedly to Unveil 2026–28 GPU Roadmap, Targeting NVIDIA H200, B200

Posted on 2026-01-12 by TrendForce

As China accelerates its push for domestic chips, Iluvatar CoreX has emerged as a new focus of industry attention following its recent listing in Hong Kong. According to ijiwei, the company disclosed that it will unveil the road map for …

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[News] NVIDIA Fuels HBM4 Race: 12-Layer Ramps, 16-Layer Push by SK hynix, Samsung, and Micron

Posted on 2026-01-09 by TrendForce

At CES 2026, NVIDIA takes the lead with its next-generation Rubin, positioning itself as the initial, exclusive HBM4 client currently. While the AI chip giant is certainly reshaping the HBM4 landscape, TrendForce observes it has pushed per-pin speeds above 11 Gbps, …

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[News] Tokyo Electron Reportedly Raises FY26 CapEx 48% to Record High, Bets on DRAM Etching Demand

Posted on 2026-01-09 by TrendForce

Rising memory prices are expected to lift production and drive stronger demand for chipmaking equipment. According to Nikkei, Toshiki Kawai, president of Tokyo Electron, said the wider adoption of AI is boosting chip demand, prompting memory makers to ramp up …

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[News] Apple Hardware Chief John Ternus May Become Next CEO as Board Reportedly Prepares for Transition

Posted on 2026-01-09 by TrendForce

Who could succeed Tim Cook as Apple’s next CEO? According to The New York Times, Apple began accelerating its succession planning in 2025, with sources saying Cook, now 65, has told senior executives that he wants to scale back his …

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