Cloud computing workloads continue to increase rapidly due to the demand coming from a diverse range of applications. However, the limited room for DDR SDRAM to achieve further breakthroughs...
Phase 1 for TSMC’s Japanese fab (JASM) is scheduled for a mass production in December 2024 at a preliminary capacity of about 5Kwspm...
Samsung Device Solutions (DS) is divided into four divisions, including Memory, System LSI, Foundry, and Advanced Package (AVP)...
According to global market intelligence firm TrendForce, the Southern Taiwan Science Park (STSP) experienced a power outage and voltage drop around 3:00 pm on June 1st...
According to global market intelligence firm TrendForce, the Southern Taiwan Science Park (STSP) experienced a power outage and voltage drop around 3:00 pm on June 1st...
According to global market intelligence firm TrendForce, China’s economy has not been recovering at the expected pace in terms of sales of goods and services since December 2022...
As indicated by the survey of global market intelligence firm TrendForce, since the US Department of Commerce extended its semiconductor sanction from logic IC to memory and HPC chips for supercompute...
Terminal sales that have yet to see a recovery, together with the worse-than-expected reduction of inventory among upstream IC design clients...
As indicated by the survey of global market intelligence firm TrendForce, the DRAM industry had generated US$9.663 billion of revenue in 1Q23 under a QoQ deterioration of 21.2%...
Off season in the consumer market, together with inventory revisions among clients, had affected Samsung Foundry’s performance in shipment and capacity utilization, which shrank its 1Q23 revenue to...
TSMC mentioned from its earnings call on April 20th that the foundry had suffered a QoQ drop of 12.8% in 1Q23 wafer shipment under clients’ inventory revisions...
TrendForce reports that the recent strong growth in the demand for AI servers has also started to raise the intensity of the discussions surrounding high-bandwidth memory (HBM)...
According to TrendForce’s continuing investigation on the US CHIPS and Science Act, the subsidy application process of this law has been formally initiated...
The subsidy specifications of the CHIPS Act by the US government restrict applicants’ investment on 1X nm and below advanced nodes, as well as 28nm and above matured nodes...
The subsidization regulations from the CHIPS Act, issued by the US Department of Commerce on March 21st...
