Samsung

HBM Market Bulletin - Aug. 15, 2025 | TrendForce

HBM Market Bulletin - Aug. 15, 2025

Aug 15, 2025 | PDF

The 2026 HBM3e market faces oversupply with Samsung likely ramping up HBM3e capacity causing price declines; HBM4 sees premium pricing amid fierce competition and concentrated NVIDIA supply.

Smartphone Market Bulletin - Aug. 14, 2025 | TrendForce

Smartphone Market Bulletin - Aug. 14, 2025

Aug 14, 2025 | PDF

In 2Q25, global smartphone production reached approximately 300 million units, up 4% quarter-over-quarter and 4.8% year-over-year. In terms of market share, Samsung maintained its leading position, be...

Foundry Market Bulletin - Aug. 11, 2025 | TrendForce

Foundry Market Bulletin - Aug. 11, 2025

Aug 11, 2025 | PDF

Driven by policy support and market demand, leading foundries improved capacity utilization and revenue growth, with new capacity expanding, and diversified platform development showing positive resul...

NAND Flash Market Bulletin - Aug. 6, 2025 | TrendForce

NAND Flash Market Bulletin - Aug. 6, 2025

Aug 06, 2025 | PDF

Samsung advances high-value NAND Flash technology amid rising AI and data center demand. Enterprise SSD growth boosts inventory digestion, yet overall NAND market recovery remains limited due to econo...

DRAM Market Bulletin - Aug. 6, 2025 | TrendForce

DRAM Market Bulletin - Aug. 6, 2025

Aug 06, 2025 | PDF

Contract negotiations see Samsung under pressure, while spot prices hold due to tight supply. Samsung's call highlights HBM3e oversupply and likely price declines. Despite higher mature DRAM prices, S...

DDR4 Shortage and Price Surge: Global Market Trends 2H25 | TrendForce

DDR4 Shortage and Price Surge: Global Market Trends 2H25

Aug 04, 2025 | PDF

In the second half of 2025, DDR4 faces structural shortages and soaring prices due to limited capacity and robust demand, with supply prioritized for servers. PC and consumer markets struggle with hig...

NAND Flash Contract Price Jul. 2025 | TrendForce

NAND Flash Contract Price Jul. 2025

Jul 31, 2025 | PDF

Driven by telecom tenders and supply adjustments, SLC/MLC NAND prices keep rising. Demand from industrial, aerospace, and AI supports continued price strength.

Mobile DRAM Contract Price 3Q25 | TrendForce

Mobile DRAM Contract Price 3Q25

Jul 31, 2025 | PDF

Driven by both reduced supply and intensified price competition among suppliers, contract prices for LPDDR4X in 3Q25 have seen further significant increases. LPDDR5X prices have also risen, supported...

NVIDIA H20 & RTX PRO Drive China’s AI Chip Market: 2025 Outlook | TrendForce

NVIDIA H20 & RTX PRO Drive China’s AI Chip Market: 2025 Outlook

Jul 15, 2025 | PDF

NVIDIA H20 may resume sales to China, boosting AI GPU supply and demand for HBM and GDDR. US policy shift favors Chinese adoption of high-end AI chips. New products like RTX PRO 6000 will further supp...

Foundry Market Bulletin - Jul. 14, 2025 | TrendForce

Foundry Market Bulletin - Jul. 14, 2025

Jul 14, 2025 | PDF

Samsung restarts US plant expansion driven by policy, but timeline and capacity growth remain uncertain; 2nm order progress depends on yield and client decisions, requiring further observation.

MRDIMM Server Memory Outlook: Driving AI & HPC Trends | TrendForce

MRDIMM Server Memory Outlook: Driving AI & HPC Trends

Jul 09, 2025 | PDF

MRDIMM addresses high-core CPU and AI needs, enhancing memory efficiency, but standards, cost, and support limit adoption.

MLCC Market Bulletin - Jul. 8, 2025 | TrendForce

MLCC Market Bulletin - Jul. 8, 2025

Jul 08, 2025 | PDF

The smartphone market shows weak third-quarter demand with cautious stocking; trade and geopolitical stability boost confidence, while AI-related orders drive growth amid cautious supply management.

LPDDR4X Supply Shrinks, Prices Surge: Smartphone Makers Accelerate Transition to LPDDR5X | TrendForce

LPDDR4X Supply Shrinks, Prices Surge: Smartphone Makers Accelerate Transition to LPDDR5X

Jul 08, 2025 | PDF

LPDDR4X supply has tightened rapidly due to reduced production and EOL plans by major suppliers, driving prices sharply higher. Under dual pressure from supply constraints and price surges, smartphone...

Glass Substrate Breakthroughs: Driving CoWoS and CPO Innovation | TrendForce

Glass Substrate Breakthroughs: Driving CoWoS and CPO Innovation

Jul 07, 2025 | PDF

Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in...

DRAM Contract Price Jun. 2025 | TrendForce

DRAM Contract Price Jun. 2025

Jun 30, 2025 | PDF

PC DRAM contract prices in Q2 2025 continue to rise, with DDR4 outpacing DDR5 due to changing supply-demand dynamics. Reduced supply, early procurement, and increased Nanya participation all contribut...

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