AI-driven demand push chiplet-based packaging; EMIB costs less than CoWoS, signaling a move to modular, efficient interconnects.
Sept 2025 server DRAM contract prices surged due to persistent CSP demand, with DDR5/DDR4 increasing. 8000MT/s modules will see accelerated adoption. Strong 2026 demand and tight supply are set to ext...
Robust AI server demand, driven by NVIDIA, AMD, and CSP custom ASICs, propels market growth. DDR5 is mainstream, yet DDR4 sees extended life and price rebound from storage needs. AMD and ARM challenge...
The surge in AI applications has fueled the development and growth of the semiconductor industry but has also brought new challenges. Apart from advanced process technology nearing physical limits and...
MRDIMM addresses high-core CPU and AI needs, enhancing memory efficiency, but standards, cost, and support limit adoption.
Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in...
DDR4 prices rise due to EOL effects and buying demand, focusing on certain players. DDR5 sees slight growth from CSP order returns with steady pricing. AMD's server market penetration grows, bene...
FPGAs have diverse functions and are widely used in various fields, and is increasing in importance with the continuous advancement of electronic devices. This report mainly analyzes the product chara...
The Semiconductor Research Department of the global market intelligence firm TrendForce reports that Intel and UMC officially announced their cooperation agreement on January 25th...
As indicated by the survey of global market intelligence firm TrendForce, the Netherlands had announced its export control on equipment for advanced nodes on June 30th that covers how restricted items...
Global market intelligence firm TrendForce reports that with Chinese government easing its measures for controlling local COVID-19 outbreaks...
TrendForce’s Department of Semiconductor Research reports that Apple’s newly released iPhone 14 series has created a certain level of product differentiation with its processor performance...
TrendForce’s Department of Semiconductor Research reports that Intel and MediaTek have formed a strategic partnership that were jointly announced by both parties on July 25th...
TrendForce’s Semiconductor Research Department reports that the P5 and P6 sections of TSMC’s Fab18B in Southern Taiwan Science Park (STSP) experienced a very brief power outage at 5:00 p.m. on July 27...
Global market intelligence firm TrendForce reports that the oversupply situation in the NAND Flash market during this second half of the year has gotten more severe...
