TrendForce provides industry research reports on AI servers and data centers, covering GPU server shipments, CSP capex trends, and liquid cooling adoption.
Reports cover GPU and ASIC server shipment forecasts, hyperscaler capex, and data center build-out dynamics; in-depth tracking of HBM (HBM3e, HBM4) supply-demand balance, market pricing, and vendor competition; alongside analysis of liquid cooling penetration, co-packaged optics (CPO) mass production progress, server CPU demand shifts, and monthly Server DRAM and DIMM contract price updates.
At the SK AI Summit 2024 on November 4th, SK hynix unveiled its HBM3e 16hi product that is currently under development. Each “cube” of this HBM3e 16hi product holds 48GB...
This week’s Bulletin provides an update on the respective market of US CSPs and corresponding enterprise OEMs...
As indicated by the survey of global market intelligence firm TrendForce, contract prices for the server market are expected to grow by 3-8% after entering 4Q24 primarily thanks to the strong demand f...
As indicated by the survey of global market intelligence firm TrendForce, NVIDIA is scheduled to mass produce GB300 between the end of 2Q25 and early 3Q25...
According to the latest survey by the global market intelligence firm TrendForce, NVIDIA’s GB200 rack solutions are set to be shipped by the end of this year...
Regarding production volume distribution, SK hynix has the highest production volume. This year, SK hynix’s total HBM production volume is projected to reach...
This week’s Bulletin provides an update on the latest dynamics of server ODMs, CPUs, and GPUs, as well as updates on the supply chain...
In the HBM datasheet released earlier in October, TrendForce revealed suppliers’ production capacity plans for 2025 and calculated HBM demand based on AI chip shipment volumes...
According to the latest survey by TrendForce, the total global server shipment volume (including AI servers) in 2024 is estimated to reach 13.7M units...
TrendForce’s observations indicate that NVIDIA is currently the global leader of AI chip supplier, and comprises of almost 90% of the GPU AI server market in 2024...
As indicated by the survey of global market intelligence firm TrendForce, negotiations for 3Q24 contract prices have mostly concluded...
This week’s Bulletin provides an update on the respective markets of Chinese CSPs and corresponding enterprise OEMs...
According to TrendForce’s investigation, Samsung is still in the process of qualifying its HBM3e 12-hi products after sending out the first batch of samples in the first half of this year...
From this August to September, HBM suppliers have been unveiling their product development plans for the period between 2025 and 2030 through events like SEMICON Taiwan 2024...
This week’s Bulletin provides an update on the latest dynamics of server ODMs, CPUs, and GPUs, as well as added updates on the supply chain of server cooling...
