This report analyzes TSMC, UMC, and PSMC's recent operations and industry outlook, focusing on new plant investments, capacity utilization, product mix, and future technology roadmaps, as well as memo...
Cloud data center expansions drive upgrades in power and cooling supply chains. BBU lithium batteries and liquid cooling are key trends, offering growth opportunities for related suppliers.
Samsung restarts US plant expansion driven by policy, but timeline and capacity growth remain uncertain; 2nm order progress depends on yield and client decisions, requiring further observation.
UMC focuses on mature processes in China with limited expansion; main growth is in Singapore fab, while Vanguard accelerates capacity in the new Singapore fab, surpassing industry growth.
Foundry Market Update: Samsung utilization rate stable, clients adjust supply chains strategically; China foundry development continues, new processes and regional capacity layouts key.
Regarding changes to orders and capacity utilization of TSMC for 2H25, advanced nodes, including 3nm and 5/4nm...
Samsung Foundry, due to its client composition, is not benefitting much from China’s subsidies. The combined revenue of Samsung Foundry and System LSI...
TSMC mentioned at the 1Q25 earnings call that 30% of 2nm capacity will be established at its Arizona fab in the future...
Regarding Samsung’s partnerships and negotiations with clients of advanced nodes, Samsung Foundry had previously concluded negotiations with Qualcomm on the 8 series flagship chips through SF2...
Last issue of the Bulletin mentioned how TSMC’s additional investment in the US has also actuated its deployment strategies in other regions of the world...
Looking at changes to Samsung Foundry’s 8-inch orders for 2025, the tendency of localized China for China production...
1. GB300: Architectural Updates 2. Major Power Supply Upgrade for GB300 3. CPO Receiving Attention 4. Refined Thermal Architecture 5. GB Shipments and CapEx Forecast for CSPs 6. TRI’s View
"TrendForce reports AI drives higher NAND Flash transmission performance demands. Samsung, to seize AI edge computing opportunities, accelerates Hybrid Bonding adoption in its V9 (286L) produ...
TSMC announced on March 4th to be investing US$100 billion in the US for three new phases, two advanced packaging plants, and one R&D center, in Arizona...
