AI Chip

Foundry Market Bulletin_20230731 | TrendForce

Foundry Market Bulletin_20230731

Jul 31, 2023 | PDF

Samsung LSI + Foundry generated roughly US$4.04 billion (calculation based on US$1=KRW$1,315.68) of revenue in 2Q23 under an approximate QoQ increase of 17.3% attributable to...

HBM Supply Bit Estimated at 105% YoY in 2024 amidst Expansions as AI Servers Continue to Ascend Demand for Accelerators | TrendForce

HBM Supply Bit Estimated at 105% YoY in 2024 amidst Expansions as AI Servers Continue to Ascend Demand for Accelerators

Jul 28, 2023 | PDF

As indicated by the survey of global market intelligence firm TrendForce, HBM (High Bandwidth Memory) products that had initially occupied roughly 1% of bit production among DRAM suppliers...

HBM Supply Bit Estimated at 105% YoY in 2024 amidst Expansions as AI Servers Continue to Ascend Demand for Accelerators | TrendForce

HBM Supply Bit Estimated at 105% YoY in 2024 amidst Expansions as AI Servers Continue to Ascend Demand for Accelerators

Jul 28, 2023 | PDF

As indicated by the survey of global market intelligence firm TrendForce, HBM (High Bandwidth Memory) products that had initially occupied roughly 1% of bit production among DRAM suppliers...

[Update] HBM3 and HBM3e to Become Market Mainstream in 2024 as AI Accelerators Advance in Demand | TrendForce

[Update] HBM3 and HBM3e to Become Market Mainstream in 2024 as AI Accelerators Advance in Demand

Jul 25, 2023 | PDF

As indicated by the survey of global market intelligence firm TrendForce, HBM2e serves as the mainstream product for the HBM (High Bandwidth Memory) market for 2023...

[Update] HBM3 and HBM3e to Become Market Mainstream in 2024 as AI Accelerators Advance in Demand | TrendForce

[Update] HBM3 and HBM3e to Become Market Mainstream in 2024 as AI Accelerators Advance in Demand

Jul 25, 2023 | PDF

As indicated by the survey of global market intelligence firm TrendForce, HBM2e serves as the mainstream product for the HBM (High Bandwidth Memory) market for 2023...

Foundry Market Bulletin_20230717 | TrendForce

Foundry Market Bulletin_20230717

Jul 17, 2023 | PDF

TSMC generated US$15.66 billion (calculation based on US$1=NT$30.7124) of revenue in 2Q23 under a QoQ reduction of roughly 6.4%, which largely coincided with the upper end of its financial forecast...

Analysis on Upstream Supply Chain Dynamics for AIGC Industry | TrendForce

Analysis on Upstream Supply Chain Dynamics for AIGC Industry

Jul 13, 2023 | PDF

AIGC is being comprehensively implemented and gradually entering human life. Currently, major technology companies, leading application service providers, numerous startups, and national institutions...

Foundry Market Bulletin_20230703 | TrendForce

Foundry Market Bulletin_20230703

Jul 03, 2023 | PDF

Samsung’s new fab (Line S6) in Taylor will be segmented into two phases. Phase 1 is planned as a 4nm fab at an approximate capacity of 30Kwspm that is scheduled for official mass production at the end...

AI Server Industry Analysis-2Q23 | TrendForce

AI Server Industry Analysis-2Q23

Jun 30, 2023 | PDF

TrendForce estimates overall AI chip shipment (including GPU, FPGA, and AISC) to arrive at 5.6 million units in 2023 under a 55% growth...

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution | TrendForce

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

Jun 20, 2023 | PDF

Cloud computing workloads continue to increase rapidly due to the demand coming from a diverse range of applications. However, the limited room for DDR SDRAM to achieve further breakthroughs...

Foundry Market Bulletin_20230619 | TrendForce

Foundry Market Bulletin_20230619

Jun 19, 2023 | PDF

Phase 1 for TSMC’s Japanese fab (JASM) is scheduled for a mass production in December 2024 at a preliminary capacity of about 5Kwspm...

Major CSPs’ Engagement in AI Server Infrastructures to Raise HBM and CoWoS Capacity by 30-40% (2023-2024) under Driver of High-End AI Chips | TrendForce

Major CSPs’ Engagement in AI Server Infrastructures to Raise HBM and CoWoS Capacity by 30-40% (2023-2024) under Driver of High-End AI Chips

Jun 15, 2023 | PDF

As indicated by TrendForce’s observations, the growth of AI servers in 2023 yielded by generated AI applications, such as ChatBOT, are seen with particularly heavy engagement from major CSPs...

Analysis on Development Trends of Liquid Cooling Technology for Data Centers | TrendForce

Analysis on Development Trends of Liquid Cooling Technology for Data Centers

Jun 15, 2023 | PDF

Thermal Design Power (TDP), as server chips improve in computability, is constantly surpassing the limit of power consumption amidst the incessant increase of temperature during summertime under clima...

Recent Trends in Development of ICT Market as Seen at Computex 2023 | TrendForce

Recent Trends in Development of ICT Market as Seen at Computex 2023

Jun 15, 2023 | PDF

Following the long COVID-19 pandemic, physical exhibitions finally returned to Computex in 2023. Even though the event did not reach the pre-pandemic level of grandeur, it still attracted significant...

Opportunities in Markets for PSUs and Liquid Cooling Solutions Generated by Rapid Growth of AI Servers | TrendForce

Opportunities in Markets for PSUs and Liquid Cooling Solutions Generated by Rapid Growth of AI Servers

Jun 14, 2023 | PDF

1. Projection on Development of AI Server Market 2. Comparison of AI Servers and Convention Servers in Terms of Energy Consumption 3. Development Trends in Higher-Spec PSUs and Liquid Cooling Soluti...

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