Monthly Archives: July 2025

[News] A Major Chinese OEM Selects Valeo’s Innovative Panoramic Head-Up Display For Its New Model

Posted on 2025-07-21 by TrendForce

Valeo has been selected by a major Chinese OEM to equip its new models with a cutting edge pillar-to-pillar Head-Up Display. Valeo’s panoramic Head-Up Display is a groundbreaking system that transforms the vehicle’s windshield into a dynamic, interactive display, seamlessly …

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Posted in Optical Semiconductors, Products News | Leave a comment

[News] NVIDIA’s H20 Production Faces Challenges? Inventory Reportedly Holds Amid Full TSMC N4 Capacity

Posted on 2025-07-21 by TrendForce

With U.S. approval to restart H20 sales in China, buzz around NVIDIA’s inventory is ramping up. Reuters, citing The Information, reports the AI chip giant has told Chinese clients that H20 supplies are running low, while TSMC has already shifted …

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Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , | Leave a comment

[News] Huawei to Unveil CloudMatrix 384, Rumored to Deliver 2× NVIDIA GB200 NVL72 Throughput

Posted on 2025-07-21 by TrendForce

Huawei is reportedly set to unveil its CloudMatrix 384 system for the first time at the 2025 World Artificial Intelligence Conference (WAIC), which opens on the 26th in Shanghai, according to Economic Daily News. As highlighted by Tom’s Hardware, the …

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Posted in Artificial Intelligence, Cloud / Edge Computing, Emerging Technologies, Semiconductors | Tagged , , , | Leave a comment

[News] Nikon Unveils DSP-100 System for Panel-Level Packaging, Supporting 600mm Panels with 9x Throughput

Posted on 2025-07-21 by TrendForce

As semiconductor giants embrace fan-out panel-level packaging (FOPLP) for larger, more efficient chip designs, Japan’s Nikon is joining the race. The company has begun taking orders in July for its new DSP-100 digital lithography system, designed specifically for 600 mm …

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Posted in IC Manufacturing, Package&Test, Semiconductors, Wafer Foundries | Tagged , , , | Leave a comment

[News] China’s Cambricon to Raise RMB 4B via A-Share Issuance for AI Chip and Software Push

Posted on 2025-07-21 by TrendForce

According to a report from MoneyDJ, citing ITHome, Chinese AI chipmaker Cambricon announced on the 17th that it has revised its A-share private issuance plan for 2025. Under the updated proposal, the company plans to issue no more than 20.9175 …

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Posted in Artificial Intelligence, Emerging Technologies, Semiconductors | Tagged , , | Leave a comment