Monthly Archives: October 2021

NAND Flash Prices Projected to Enter Cyclical Downturn in 2022 Due to Modest Demand Growth and Competition for Higher-Layer NAND, Says TrendForce

Contract prices of NAND Flash products are expected to undergo a marginal drop of 0-5% QoQ in 4Q21 as demand slows, according to TrendForce’s latest investigations. Hence, the current cyclical upturn in NAND Flash prices will have lasted for only two …

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Annual Shipment of AirPods Expected to Reach 85 Million Sets, with Component Suppliers Epistar, DOWA, II-VI/Finisar Set to Benefit, Says TrendForce

Apple’s latest AirPods 3 still feature an optical in-ear detection mechanism, according to TrendForce’s 2021 Infrared Sensing Market Trend – 3D Sensing, LiDAR, SWIR LED report. Through the integration of PPG (photoplethysmography) technology, the AirPods 3 contain an improved in-ear detection mechanism based …

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Why did TSMC choose to build a chip plant in Japan?

Having experienced in worldwide lockdown caused by COVID-19 and rising geopolitical worries in recent years, governments of various countries hope to have wafer manufacturing plants in their own territories to reduce the possible impact of supply chain disconnection; however, building …

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Taiwanese Server ODMs Expected to Account for About 90% of Global Server Production in 2021 by Expanding Production Capacities Outside of Domestic China, Says TrendForce

Escalating trade tensions between the US and China, rising geopolitical issues, increased tariffs, and uncertainties stemming from the COVID-19 pandemic’s emergence last year have compelled server ODMs to actively shift their operations closer to clients as well as engage in …

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EDA Expected to Become Primary Focus of Development under China’s New IC Policies

TrendForce’s investigations show that, among the three categories in the upstream semiconductor supply chain, which consist of semiconductor manufacturing equipment, materials, and EDA, China made the most progress regarding self-sufficiency in semiconductor equipment, followed by materials, with EDA coming in …

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