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Server Market Bulletin - Oct. 30, 2025
Last Modified
2025-10-30
Update Frequency
Biweekly
Format
AI servers lead growth; cloud build-outs lift ODMs/thermal. AMD ramps; TPU up; shift to L2L cooling. Supply chain heat-up end to end.
Key Highlights
- Market: AI servers lead; cloud build-outs lift server/thermal.
- Demand: NA hyperscalers expand GB racks and in‑house ASICs.
- ODMs: Foxconn, Quanta, Supermicro accelerate AI racks.
- Chips: AMD ramps; Google TPU demand strengthens.
- Thermal: Liquid cooling shifts L2A→L2L; Auras, Fositek expand.
Table of Contents
- TrendForce's View
- ODM Dynamics
- 2025 YoY Growth in L6 MB Production among ODMs
- Major Chips Dynamics
- Thermal/Power Related Updates
<Total Pages: 5>
Category: DRAM , Cloud / Edge Computing , Artificial Intelligence , AI/HBM/Server
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