Server Market Bulletin - Sep. 4, 2025
Last Modified
2025-09-04
Update Frequency
Biweekly
Format
AI servers remain higher than general-purpose servers regarding shipment dynamics among ODMs in 2H25, thus triggering growths for liquid-cooling suppliers. Liquid-cooling solutions are likely to penetrate the cloud market continuously, with focuses placed on cold plates and dividers. Supply chain players are cultivating their partnerships with major US CSPs to stabilize shipment and upgrades. Growth momentum would mostly stem from expanded deployments among CSPs and high-power servers.
Key Highlights
- Liquid cooling core with Cold Plate and Manifold, strengthened cloud partnerships underpin growth.
- Collaborations with cloud platforms broaden market for AI-ready servers and high-power configurations.
- AI server demand drives capacity expansion and practical design collaboration.
- Competitive edge rests on total-solution design, customization, and in-house component supply.
Table of Contents
- TrendForce's View
- ODM Dynamics
- 2025 YoY Growth in L6 MB Production among ODMs
- CPU, GPU and ASIC Dynamics
- Thermal/Power Related Updates
<Total Pages: 5>

Category: DRAM , Cloud / Edge Computing , Artificial Intelligence , AI/HBM/Server
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