TSMC generated US$15.66 billion (calculation based on US$1=NT$30.7124) of revenue in 2Q23 under a QoQ reduction of roughly 6.4%, which largely coincided with the upper end of its financial forecast...
Samsung’s new fab (Line S6) in Taylor will be segmented into two phases. Phase 1 is planned as a 4nm fab at an approximate capacity of 30Kwspm that is scheduled for official mass production at the end...
As indicated by the survey of global market intelligence firm TrendForce, mainstream wafers had remained flat in ASP during June...
Phase 1 for TSMC’s Japanese fab (JASM) is scheduled for a mass production in December 2024 at a preliminary capacity of about 5Kwspm...
Samsung Device Solutions (DS) is divided into four divisions, including Memory, System LSI, Foundry, and Advanced Package (AVP)...
As indicated by the survey of global market intelligence firm TrendForce, mainstream wafers had leveled in ASP during May, and transactions were relatively vigorous in the Chinese market...
According to global market intelligence firm TrendForce, high inflation caused companies across sectors to scale back capital expenditure for this year...
Terminal sales that have yet to see a recovery, together with the worse-than-expected reduction of inventory among upstream IC design clients...
Off season in the consumer market, together with inventory revisions among clients, had affected Samsung Foundry’s performance in shipment and capacity utilization, which shrank its 1Q23 revenue to...
As indicated by the survey of global market intelligence firm TrendForce, mainstream wafers had further declined in ASP at about...
TSMC mentioned from its earnings call on April 20th that the foundry had suffered a QoQ drop of 12.8% in 1Q23 wafer shipment under clients’ inventory revisions...
The subsidy specifications of the CHIPS Act by the US government restrict applicants’ investment on 1X nm and below advanced nodes, as well as 28nm and above matured nodes...
As indicated by the survey of global market intelligence firm TrendForce, average concluded prices of wafers saw an apparent reduction this month at an average of 12% for mainstream 512Gb TLC wafer...
The subsidization regulations from the CHIPS Act, issued by the US Department of Commerce on March 21st...
Pertaining to how UMC mentioned from its 4Q22 earnings call that the HV (High Voltage) process would evolve from the current mainstream 28nm to 17nm in the future...
