Trade War

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

Jun 20, 2023 | PDF

Cloud computing workloads continue to increase rapidly due to the demand coming from a diverse range of applications. However, the limited room for DDR SDRAM to achieve further breakthroughs...

China’s Matured Node Expansion Overcasted as Japan Announced Export Control Regulations on Semiconductor Equipment

May 24, 2023 | PDF

As indicated by the survey of global market intelligence firm TrendForce, since the US Department of Commerce extended its semiconductor sanction from logic IC to memory and HPC chips for supercompute...

21.2% QoQ Drop in 1Q23 Revenue amidst Sluggish Demand after Three Consecutive Quarters of Depletion

May 18, 2023 | PDF

As indicated by the survey of global market intelligence firm TrendForce, the DRAM industry had generated US$9.663 billion of revenue in 1Q23 under a QoQ deterioration of 21.2%...

NAND Flash Market Bulletin_20221221

Dec 21, 2022 | PDF

The latest wave of sanctions (announcement of Entity List) imposed on Chinese suppliers by the US has prevented sellers from engaging active sales of wafer contracts during December...

As Decline in Memory Prices Continues, Production Cost Will Determine Memory Suppliers’ Profitability and Guide Their Decisions on Production Cut

Dec 13, 2022 | PDF

The latest research by global market intelligence TrendForce reveals that from the start of 2022 onward, the memory market as a whole has been affected by continuous supply expansion and weakening dem...

3Q22 Enterprise SSD Revenue Dropped to US$5.221 Billion as Server OEMs Suppressed Orders amidst Unrecovered Chinese Orders

Nov 25, 2022 | PDF

As indicated by the survey of global market intelligence firm TrendForce, 3Q22 had carried on with the purchase intensity of enterprise SSD seen from 2Q22...

Chinese Buyers Permitted for Server Component Procurement after Signing MOU as US DOC Reinforces Sanction on China

Oct 12, 2022 | PDF

As indicated by the survey of global market intelligence firm TrendForce, the superposition effect from the series of sanctions imposed by the US Department of Commerce on China since 2018 have been g...

US Department of Commerce Extends Scope of Semiconductor Technology Export Restrictions Against China from Logic ICs to Memory

Oct 08, 2022 | PDF

The US Department of Commerce announced the latest semiconductor technology export restrictions against China on October 7th (local time). The export control regime...

US Department of Commerce Extends Scope of Semiconductor Technology Export Restrictions Against China from Logic ICs to Memory

Oct 08, 2022 | PDF

The US Department of Commerce announced the latest semiconductor technology export restrictions against China on October 7th (local time). The export control regime...

Top 10 Global SSD Module Makers Ranking for 2021

Oct 03, 2022 | PDF

According to the research by global market intelligence firm TrendForce, supply was very tight for foundry wafers in 2021. As a result, lead time was prolonged for orders related to SSD controller ICs...

Global Smartphone Production Fell by 6% QoQ to 292 Million Units for 2Q22; China’s COVID-19 Containment Policy Further Impaired Smartphone Brands’ Performances

Aug 24, 2022 | PDF

Global market intelligence firm TrendForce reports that smartphone brands’ device production plans for 2Q22 were already fairly conservative because they had prioritized channel inventory adjustments....

DRAM Demand Bit Growth Forecasted to Reach New Low in 2023 as Hyperinflation Continues to Impact Consumer Demand; NAND Flash Content per Box Could Increase Due to Price Elasticity of Demand

Jul 27, 2022 | PDF

Global market intelligence firm TrendForce reports that shipments of NBs and smartphones in 1H22 were impacted by a demand freeze in the wider consumer electronics market...

Demand below Supply in Growth Intensity during 2022 to Initiate a Price Reduction Cycle for the DRAM Industry

Sep 08, 2021 | PDF

As indicated by the survey of global market intelligence firm TrendForce, the negotiation in 3Q21 contract prices has been predominantly finalized between suppliers and major clients...

Japan Becomes New Frontline Base in Packaging and Material R&D for TSMC’s Global Strategic Deployment

Jul 09, 2021 | PDF

According to global market intelligence firm TrendForce, TSMC, nine months after announcing the fab expansion in the US during May 2020, had once again announced in February 2021...

DRAM Industry Analysis－1Q21

Feb 24, 2021 | PDF

The inclusion of Huawei into the Entity List during late-3Q20 had triggered an amplified purchase intensity in components and parts for several Chinese smartphone brands...