Liquid Cooling Research & Analysis | TrendForce

Major CSPs’ Engagement in AI Server Infrastructures to Raise HBM and CoWoS Capacity by 30-40% (2023-2024) under Driver of High-End AI Chips | TrendForce

Major CSPs’ Engagement in AI Server Infrastructures to Raise HBM and CoWoS Capacity by 30-40% (2023-2024) under Driver of High-End AI Chips

Jun 15, 2023 | PDF

As indicated by TrendForce’s observations, the growth of AI servers in 2023 yielded by generated AI applications, such as ChatBOT, are seen with particularly heavy engagement from major CSPs...

LPDDR5X Contract Prices to See Early Stoppage in Reduction from Cost Considerations and Suppliers’ Pricing Strategies | TrendForce

LPDDR5X Contract Prices to See Early Stoppage in Reduction from Cost Considerations and Suppliers’ Pricing Strategies

Jun 13, 2023 | PDF

As indicated by the Semiconductor Research division of global market intelligence firm TrendForce, smartphones, compared to other consumer products...

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