Daily Archives: 2026-07-29

[News] Chinese Advanced Packaging Firms Kicks-Start a New Round of Capacity Expansion

Posted on 2026-07-29 by TrendForce

China is witnessing a fresh wave of investment in advanced semiconductor packaging, with a series of expansion projects targeting AI computing, automotive-grade chips, and next-generation memory technologies. According to incomplete statistics, nearly ten major advanced packaging projects have been announced …

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[News] China’s Semiconductor Sector Attracts Billions in Industrial Investment Funds

Posted on 2026-07-29 by TrendForce

A new wave of industrial capital is moving into the China’s semiconductor sector, as local governments and industry leaders accelerate investments in strategic technologies. Recently, Shenzhen, Shanghai and Wuhan have unveiled a series of major industrial fund initiatives and registration …

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