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Monthly Archives: June 2022
Global Packaging and Testing Output Value Reached US$82.139 Billion in 2021, 25.83% YoY, China Becomes Fastest Growing Market
According to TrendForce research, driven by strong demand for 5G mobile phones, base stations, automobiles, and HPCs, the global output value of packaging and testing (including foundry and IDM) reached US$82.139 billion in 2021, or 25.83% YoY. This upward momentum …
Posted in Semiconductors, Wafer Foundries
Tagged advanced packaging, Amkor, ASE, IC packaging, TrendForce, wafer
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