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keyword:Sean Yang55 result(s)

Press Releases
TrendForce Says NAND Flash Revenue Grew 17.8% Sequentially in Fourth Quarter of 2016 as Supply Shortage Reached Its Most Severe Phase

2017/03/07

Semiconductors

In the fourth quarter of 2016, the NAND Flash market was at its most severe phase of shortage for the year while shipments in the end device markets were robust Consequently, average sales prices (ASPs) of NAND Flash products rose significantly, and the fourth-quarter global NAND Flash revenue registered a large sequential increase of 178% even with the strong third-quarter result as the base NAND Flash suppliers made a strong finish to 2016 as their profits also peaked in the final quarter “Contract prices of NAND Flash products in the first quarter of 2017 will continue to climb due to the undersupply situation caused by the industry-wide migration to 3D-NAND architecture,” said Sean Yang, research director of DRAMeXchange, a division of TrendForce “End demand has fallen compared with the fourth quarter of last year because of seasonality, so the growth in NAND Flash revenue will be moderate On the whole, suppliers can expect sequential revenue increase for every quarter in 2017 as the market supply is expected to remain tight through the year” Samsung For the fourth quarter of 2016, Samsung’s NAND Flash business registered a sequential growth of 11~15% for bit shipments and an increase of more than 5% in ASP These results were attributed to strong demand for high-capacity eMMC, UFS and SSD products Thus, Samsung’s NAND Flash revenue for the fourth quarter advanced by nearly 20% sequentially Samsung continues to be the market leader for high-capacity mobile storage products (ie eMMC and UFS) and for SSDs The company is well ahead of the second-place competitors in terms of market shares and therefore benefits significantly from the recent surge in NAND Flash prices At the same time, Samsung is using 48-layer 3D-NAND Flash for all its SSD lines Looking at Samsung’s production plans, the 2D- to 3D-NAND conversion at the Line 16 facility continues Line 17 and the plant in Pyeongtaek, South Korea are designated for 3D-NAND production, but they are not expected to make significant contribution to Samsung’s 3D-NAND capacity until after the second quarter of this year Therefore, bit shipments for this first quarter will fall by around 4~9% compared with the previous quarter If Samsung’s plans proceed according to schedule, then its NAND Flash bit shipments will again expand after the second quarter SK Hynix In the fourth quarter of 2016, SK Hynix scaled back SSD shipments while increasing eMCP shipments in response to the demand from Chinese smartphone brands Consequently, the supplier’s bit shipments for the quarter post a slight sequential drop of 3% but its ASP of NAND Flash chips saw a large sequential hike of 14% On the whole, SK Hynix’s NAND Flash business grew its revenue by 9% sequentially in the fourth quarter, totaling around US$116 billion Going into the first quarter of 2017, SK Hynix’s NAND Flash bit shipments will also be affected by the transition to 3D-NAND as well as declining smartphone shipments during the period The supplier’s bit shipments could drop by around 5% sequentially However, ASP of NAND Flash chips is going to be on a steady rise due to the ongoing market undersupply With regard to SK Hynix’s transition to 3D-NAND, the advanced architecture is estimated to account for 10% of the supplier’s bit shipments for the first quarter of 2017 SK Hynix is currently releasing 48-layer products and will also be launching 72-layer products in the second half of this year By the end of 2017, 3D-NAND products are expected to make up more than 50% of SK Hynix’s NAND Flash output Toshiba Toshiba is presently working on products using 64-layer 3D-NAND Flash and has scheduled formal mass production in the second half of 2017 As Toshiba is still raising the yield of the 64-layer production, the company’s memory business is going to focus on the sales of its 48-layer products during this year’s first half Overall, the share of 3D-NAND products in Toshiba’s total NAND Flash output remains relatively small Nonetheless, the supplier is keeping its target of increasing the output share of 3D-NAND to more than 50% by the end of 2017 Western Digital NAND Flash revenue for Western Digital’s fiscal second quarter of 2017 rose by about 20% sequentially due to increase in both bit shipments and ASP Western Digital also continue to perform strongly in the SSD market, indicating that the company’s acquisition of SanDisk has led to an effective integration of HDD and SSD lines In terms of product planning, Western Digital has already added its own branded 64-layer 3D-NAND chips into its retail portfolio Sampling of PC-OEM SSDs based on the same memory technology is also taking place in this first quarter The share of 3D-NAND products in the supplier’s total NAND Flash output is expected to exceed 50% by the end of 2017 Micron As with other suppliers, Micron gained enormously from the tight market supply and the strong overall demand In the company’s first fiscal quarter of 2017, Micron posted a large sequential increase of 26% for its NAND Flash bit shipments The supplier’s NAND Flash revenue also grew 27% compared with the previous fiscal quarter to reach around US$127 billion When Micron’s NAND Flash revenue for its 2017 fiscal first quarter is split according to products, the revenue shares of component base products, mobile products, automotive/industrial products and SSD products are respectively 40%, 23%, 15% and 20% Revenue share increased for all categories except component base, which saw a decline The share of 3D-NAND products in Micron’s NAND Flash bit output has already risen above 50% Following Samsung, Micron is the second supplier to have 3D-NAND products accounting for more than half of the NAND Flash output Moreover, Micron has schedule the mass production of its next-generation 64-layer 3D-NAND Flash in the second half of 2017 The share of Micron’s 2D-NAND products in the total NAND Flash output is projected to shrink to about 10% after 2017 Nevertheless, Micron is expected to retain some 2D-NAND production to satisfy the demand for specialty memory products Intel Intel posted a large sequential increase of more than 25% for its NAND Flash bit shipments in the fourth quarter of 2016 because of the high demand for enterprise-grade SSDs The supplier’s NAND Flash revenue for the quarter also grew 25% sequentially to US$816 million With regard to product planning, Intel will gradually scale down the production of its 20nm and 25nm products while increasing the weight of enterprise-grade SSD products based on both 3D-NAND and MLC technologies These 3D-NAND MLC SSDs can be priced competitively and help Intel improve the overall cost structure and profitability At the same time, Intel is now starting the mass production of 3D-NAND TLC products

Press Releases
TrendForce Forecasts Moderate Price Hikes for SSDs and eMMCs in Second Quarter of 2017; New iPhones to Drive NAND Flash Demand in This Year’s Second Half

2017/02/23

Semiconductors

The global supply of 2D-NAND Flash will remain tight going into the second quarter of 2017, according to the latest analysis from DRAMeXchange, a division of TrendForce Also, major smartphone brands will soon begin their first wave of new product release for the year after the Mobile World Congress in Spain With the NAND Flash supply still under strain, DRAMeXchange forecasts that contract prices of both SSDs and eMMCs will see a more moderate sequential price hike of 5~10% in the second quarter The end of 2016 saw the most severe phase of shortage in the NAND Flash market, and since then the market expectation of undersupply has kept prices climbing For the first quarter of 2017, DRAMeXchange estimates that the average sequential increases in contract prices of eMMCs and SSDs will come to 15~20% and 10~15%, respectively The sequential contract price increase for SSDs in the first quarter will also be the highest in almost two years Apart from the pressure of soaring NAND Flash prices, smartphone and notebook brands are also dealing with sharp price upswings for other key components such as DRAM and LCD panels In order to keep costs down and maintain healthy margins, device vendors will implement measures that will also lead to slowing growth in the average content per box for eMMCs and SSDs in the near future “The accumulated price increase in the NAND Flash market has become so huge that device vendors are currently revising their initial plans to raise the storage specifications of their products,” said Sean Yang, research director of DRAMeXchange “Though the NAND Flash market will remain strong the second quarter of this year, eMMCs and SSDs will see a more moderate hike in their contract prices compared with increases of the previous quarters” Looking ahead to the rest of 2017, the market for enterprise-grade SSDs constitutes the strongest and most stable source of end demand for NAND Flash compared with other applications Server vendors are enjoying booming growth of data centers, and this is also driving their use of high-efficiency enterprise-grade SSDs when designing their systems As for the client-grade SSD market, the growth in the average content per box will slow down this year due to the high NAND Flash prices Nonetheless, SSDs have become standard in notebooks and their penetration in the notebook market will continue to rise through 2017 Yang in his analysis also pointed out the next iPhone release in the second half of this year will be an important indicator of the NAND Flash market “The 10th anniversary iPhone devices will come with major hardware upgrades and many new features,” said Yang “If they do well in sales, it will help keep up NAND Flash demand in the latter half of 2017”

Press Releases
Toshiba Spins Off Memory Business to Strengthen Its NAND Flash Competitiveness, TrendForce Reports

2017/01/27

Semiconductors

Toshiba officially announced today that its memory business will be spun off Although the detail is not disclosed yet, but overall the procedure will be completed by March 31st  DRAMeXchange, a division of TrendForce, believes that from this point on, Toshiba’s memory business will have more operational flexibility and stronger fundraising ability These advantages in the long run will benefit the Toshiba-Western Digital alliance in the forms of expansion in NAND Flash production capacity and increased efficiency in storage product development “Toshiba wants to put its memory business in a more stable financial position,” said Sean Yang, research director of DRAMeXchange “Facing mounting operational and competitive pressure, the spun-off entity will be more effective in raising cash to stay afloat or expand” Currently, Toshiba and Western Digital together represent 35% of the global NAND Flash output, according to DRAMeXchange The leading supplier Samsung has a slightly larger share of 36%, while the Micron-Intel camp and SK Hynix account for 17% and 12%, respectively Samsung, SK Hynix and Micron are also the three top DRAM suppliers, so their roadmaps for memory products as a whole are much more developed By contrast, Toshiba and its ally Western Digital are limited to just the NAND Flash industry For Toshiba and Western Digital, the capital-intensive nature of the memory industry and the volatility of the end market will make their operational challenges more difficult compared with similar issues encountered by their rivals From the financial angle, Toshiba’s latest fiscal quarterly report shows that memory sales roughly made up around 15% of the company’s total quarterly revenue However, up to 50% of the company’s operating margin for the period also came from the same source This means that memory has become the main profit driver for Toshiba Among Toshiba’s various ventures, memory business would also receive the greatest attention from the parent company in terms of investment and resource allocation However, Toshiba’s solvency and fundraising ability are presently in doubt because of the accounting scandal and the huge loss related to the nuclear plant purchase Its financial problems were a major drag on the growth of its memory business “The spin-off deal therefore intends to make fundraising less difficult for Toshiba’s memory business, which will need a steady stream of capital to develop and compete in the memory industry,” Yang noted “As a separate entity, the memory business will be in a better position to make significant changes to its operation and cost structure, making it more attractive to investors At the same time, Toshiba’s move bolsters its NAND Flash partnership with Western Digital, showing commitment and renewed strength in this area”

Press Releases
TrendForce Expects NAND Flash Prices to Keep Rising During 2017 as Industry’s Wafer Capacity Will Expand by Just 6% Annually

2016/12/21

Semiconductors

The global NAND Flash industry will see an annual increase of just 6% in its total wafer capacity in 2017, according to analysis by DRAMeXchange, a division of TrendForce As the pace of the industry-wide transition to 3D-NAND architecture accelerates, supply of 2D-NAND memory will drop sharply, leading to shortages next year Furthermore, many suppliers are still working on the mass production of 3D-NAND memory Until the industry in general is able to apply 64-layer 3D-NAND solutions to OEM storage products, the market supply for 3D-NAND memory will remain tight In the meantime, NAND Flash prices will continue to go up and boost suppliers’ revenues 3D-NAND will be the main driver of Flash bit shipments in 2017; 2D-NAND will account for less than 50% of the total bit shipments by the next third quarter Sean Yang, research director of DRAMeXchange, noted that most NAND Flash suppliers this year have undertaken the migration to next-generation architecture and capacity expansion efforts concurrently “Since the second quarter of 2016, suppliers have sped up their respective 3D-NAND development process,” said Yang “By the end of this year, 3D-NAND is estimated to represent about 30% of the total Flash bit shipments” However, the NAND Flash industry’s wafer capacity is projected to increase by a marginal annual rate of 6% in 2017 Many suppliers will reduce shipments of their 2D-NAND memory products so that more of their existing manufacturing capacity can be used for 3D-NAND production DRAMeXchange forecasts that the market supply of 2D-NAND Flash will begin to fall sharply in the next first quarter By the third quarter of 2017, the share of 2D-NAND in the industry’s total bit shipments will be under 50% As suppliers move forward in their transition to 3D-NAND technology, technological challenges will become more difficult Currently, many suppliers are striving to raise their yield rates for 64-layer 3D-NAND and applying this solution to various OEM products such as eMMC, UFS and client- and enterprise-grade SSDs DRAMeXchange expects that the 64-layer 3D-NAND memory will be ready for mass production and shipments in the third quarter of next year at the earliest Meanwhile, the market supply of 3D-NAND memory will be fairly limited The SSD market will enjoy soaring demand next year and its representation in global NAND Flash consumption will reach 40% As smartphone shipments show slowing growth and tablet shipments continue to contract, the trend towards increase in the memory content per box has become the main demand driver for mobile NAND Flash products Since the 128GB storage option accounts for the largest share of iPhone 7 shipments, other smartphone brands have also quickly equipped their devices with high-capacity eMMC and UFS in order stay competitive The NAND Flash market will also continue to benefit from the SSD boom Based on DRAMeXchange’s latest analysis, more than 50% of notebook shipped worldwide during the fourth quarter of 2017 will carry SSDs In the enterprise-grade SSD market, demand continues to rise on account of strong growth in the data center and server markets Set against the prior year, total SSD demand worldwide is projected to soar by 60% in 2017 Furthermore, SSD demand is forecast to account for 40% of the global NAND Flash consumption for next year Thus, SSDs will represent the fastest growing end-use market for NAND Flash in 2017

Press Releases
Shortage of NAND Flash to Cause Prices of SSDs and EMMCs to Rise by Over 10% Sequentially in First Quarter of 2017, Says TrendForce

2016/12/12

Semiconductors

DRAMeXchange, a division of TrendForce, reports that the global shortage of NAND Flash has reached its most severe phase for 2016 in this fourth quarter Factors that aggravate the shortage include strong smartphone shipments, growing SSD demand and the increase in the average memory density of eMMCs and eMCPs Prices of various NAND Flash products are now at their highest for this year as the market anticipates the undersupply situation to persist well into the first quarter of 2017 Between this year’s fourth quarter and next year’s first quarter, contract prices of enterprise- and client SSDs are expected to rise by over 10%, while mobile products such as eMMC and UFS will register even larger contract price increases The market survey for the fourth quarter reveals that prices of NAND Flash chips and wafers sold in the channel markets have reached new heights for this year In the contract markets, eMMC and UFS have seen sequential price increases of 9~13%, while prices enterprise- and client-grade SSDs also have also advanced 5~10% compared with the third quarter “From the supply side, the industry-wide transition to 3D-NAND is now moving at full speed,” said Sean Yang, research director of DRAMeXchange “However, most suppliers with the exception of Samsung have not improve their yield rates for the technology as quickly as they would like While 3D-NAND Flash supply remains tight, the transition to the new architecture has resulted in a sharp production decrease and supply shortage for 2D-NAND (planar NAND) memory” As for the demand situation in the fourth-quarter NAND Flash market, Yang noted that the majority of Flash components including eMMC, eMCP and UFS is still based on the 2D-NAND architecture At the same time, Chinese smartphone brands such as Huawei, OPPO and Vivo have placed large volumes of additional orders for high-capacity eMMCs and eMCPs because they are encouraged by the strong shipments of their devices “Demand from Chinese smartphone brands is the main contributing factor to the current shortage of 2D-NAND Flash and has also indirectly caused the price hikes for wafers and chips in the channel markets,” said Yang “As memory suppliers have shifted more of their available capacity to meet the demand from smartphone brands, they have also scaled back shipments to memory module makers” The undersupply of 2D-NAND Flash is further compounded by the increase in memory content per box for mobile NAND products and the growing demand for SSDs “OEMs can expect supply shortage to continue into the first quarter of 2017 By that time, NAND Flash prices may climb to new peaks,” said Yang The aggregate price increase in the NAND Flash market since this second quarter is enormous Consequently, the demand growth for NAND-based products in the channel markets has diminished slightly as branded vendors and retailers raised their prices At the same time, unit production costs are becoming more difficult to assess for PC-OEMs and smartphone makers as prices of mobile and PC storage components have kept rising On the whole, branded device manufacturers are preparing for continuing price increases in the NAND Flash market in the first quarter of 2017 Afterwards, shipments and the increase in memory content for smartphones, along with industry’s progress in 3D-NAND manufacturing, will determine the general price trend

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