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keyword:John Wang10 result(s)

Press Releases
Revenue of Top 10 OSAT Companies for 2Q21 Reaches US$7.88 Billion Due to Strong Demand and Increased Package/Test Prices, Says TrendForce

2021/09/06

Semiconductors

Despite the intensifying COVID-19 pandemic that swept Taiwan in 2Q21, the domestic OSAT (outsourced semiconductor assembly and test) industry remained largely intact, according to TrendForce’s latest investigations Global sales of large-sized TVs were brisk thanks to major sporting events such as the Tokyo Olympics and UEFA Euro 2020 Likewise, the proliferation of WFH and distance learning applications propelled the demand for IT products, while the automotive semiconductor and data center markets also showed upward trajectories Taking into account the above factors, OSAT companies raised their quotes in response, resulting in a 264% YoY increase in the top 10 OSAT companies’ revenue to US$788 billion for 2Q21 TrendForce indicates that, in light of the ongoing global chip shortage and the growing production capacities of foundries/IDMs in the upstream semiconductor supply chain, OSAT companies gradually increased their CAPEX and expanded their fabs and equipment in order to meet the persistently growing client demand However, the OSAT industry still faces an uncertain future in 2H21 due to the Delta variant’s global surge and the health crisis taking place in Southeast Asia, home to a significant number of OSAT facilities Regarding the performances of individual OSAT companies in 2Q21, market leader ASE and Amkor each recorded revenues of US$186 billion and US$141 billion, which represented YoY growths of 351% and 199%, respectively, for the quarter Both companies benefitted from strong demand for 5G smartphones, notebook computers, automotive chips, and networking chips In particular, ASE allocated some of its capacities to KYEC (which suffered a drop in its IC testing capacity due to the pandemic) and therefore experienced a surge in its revenue Also posting a revenue growth in 2Q21 was Amkor, which took second place on the top 10 list owing to the high demand for automotive chips, HPC chips, and 5G handsets released by Apple and other smartphone brands SPIL’s revenue for 2Q21 reached US$931 million, a modest 23% YoY increase The company’s relatively muted growth can be attributed to the fact that smartphone IC packaging demand from Huawei, one of SPIL’s major clients, had plunged, while other smartphone brands did not place orders sufficient for making up for this plunge As previously mentioned, some of KYEC’s testing capacities were adversely affected by the COVID-19 pandemic, resulting in a 68% YoY increase in KYEC’s revenue to a mere US$274 million for 2Q21 PTI gradually recovered from difficulties resulting from the closure of its Japanese and Singaporean subsidiaries For 2Q21, PTI’s revenue reached US$742 million, a 143% YoY increase Regarding Chinese OSAT companies, JCET and Hua Tian both expanded their capacities in order to meet the massive demand from the domestic 5G telecom, base station, consumer electronics, and automotive markets While JCET and Hua Tian continue to operate in accordance with China’s goal of achieving domestic semiconductor substitutes, the two companies’ revenues for 2Q21 reached US$11 billion and US$467 million, which represented YoY growths of 25% and 647%, respectively It should be pointed out that TFME also benefitted from the aforementioned market demand TFME’s revenue reached US$591 million, a 683% YoY increase, which was the highest increase among the top 10 OSAT companies in 2Q21 TFME’s impressive growth took place primarily because the company is the main OSAT provider for AMD As AMD captured some of Intel’s market share, both AMD and, by extension, TFME, experienced a resultant revenue growth Finally, ChipMOS and Chipbond, which specialize in panel driver IC packaging and testing, benefitted from major sporting events such as the Tokyo Olympics and UEFA Euro 2020 Given the skyrocketing demand for display panels, IC testing demand for driver ICs, including TDDI and DDI, also underwent a corresponding rise Notably, due to a shortage of packaging materials, ChipMOS raised the price of its packaging services for memory products and subsequently registered a spike in both revenue and gross profits While both companies’ revenues reached US$251 million, ChipMOS and Chipbond each registered revenue growths of 384% YoY and 496% YoY, respectively For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

Press Releases
Driven in Part by Demand for New Energy Vehicles, GaN Power Devices Market Projected to Grow at 78% CAGR Through 2025, Says TrendForce

2021/09/03

Semiconductors

Demand for telecom base stations, converters, and charging stations has seen considerable growth this year as a result of ongoing developments in 5G telecommunication, consumer electronics, industrial energy conversion, and new energy vehicles (NEV), according to TrendForce’s latest investigations While this demand generated a corresponding surge in demand for components and devices powered by third-generation semiconductors GaN and SiC, the GaN power devices market is expected to undergo the highest magnitude of growth TrendForce expects GaN power devices revenue for 2021 to reach US$83 million, an impressive 73% YoY increase According to TrendForce’s investigations, GaN power devices are primarily used in consumer electronics; annual GaN power devices revenue is expected to grow at a 78% CAGR and reach US$850 million in 2025 Regarding applications, consumer electronics, NEVs, and telecom/data centers, in order, comprise the three largest sources of GaN power devices consumption, at 60%, 20%, and 15%, respectively TrendForce finds that about 10 smartphone OEMs have released more than 18 models of smartphones equipped with fast charging capability, while notebook manufacturers are also indicating a willingness to adopt fast charging for notebook computers Annual SiC revenue, on the other hand, is expected to grow at a 38% CAGR and reach US$339 billion in 2025, with NEVs, solar power generation/storage, and charging stations representing the top three largest source of SiC power device consumption, at 61%, 13%, and 9%, respectively For the NEV industry, in particular, SiC power devices are most widely used in powertrain inverters, OBCs (on board chargers), and DC-DC converters Major IDMs from Europe, the US, and Japan still control the vast majority of substrate supply Due to their relative difficulty in epitaxial growth and the fact that the industry is moving from 6-inch towards 8-inch substrates as the mainstream, third-generation semiconductor GaN and SiC substrates are 5-20 times more expensive to manufacture compared to traditional 8-inch and 12-inch Si substrates It should be noted that most substrate materials are, at the moment, controlled by such major IDMs as US-based Cree and II-VI, Japan-based Rohm, and Europe-based STMicroelectronics In response to this oligopoly, certain Chinese suppliers, including SICC and Tankeblue, have successively entered the substrate market with the support of China’s 14th five-year plan Their participation will likely accelerate China’s goal of semiconductor self-sufficiency Although substrate suppliers from Europe, the US, and Japan enjoy an early presence in the market and possess relatively mature process technologies, TrendForce believes that Taiwanese suppliers still hold certain competitive advantages For instance, not only do Taiwanese companies have vast experiences in silicon development, but Taiwan is also home to a comprehensive upstream/downstream silicon supply chain In addition to these aforementioned advantages, Taiwan is further aided by policies that promote domestic material supply, design, and technological development Taiwan is therefore well on its way to achieving its goal of becoming a center of advanced semiconductor fabrication that derives its strength from a gradually maturing front-end substrate and epitaxy industry chain, as well as mid- and back-end competencies in chip design, manufacturing, and packaging Currently, two major strategic alliances, led by Hermes-Epitek (with subsidiaries EPI and EPISIL), and SAS (with subsidiaries GW, AWSC, CWT, and ATC) are attempting to maximize their efforts in Taiwan’s lacking substrate industry Furthermore, TAISIC, jointly funded by KENMEC and TAINERGY, has submitted 4-inch SiC substrates for qualification and is actively investing in 6-inch SiC substrate R&D For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

Press Releases
MCO 3.0 Lockdown in Malaysia, Hotspot for Packaging/Testing and Passive Component Manufacturing, Projected to Have No Effect on Semiconductor Companies, Says TrendForce

2021/06/02

Semiconductors

National governments in Southeast Asian countries, including Thailand, Vietnam, and Malaysia, have been instituting increasingly stringent pandemic control measures in response to the intensifying COVID-19 pandemic in these countries Remarkably, these countries are all hotspots in the electronic component supply chain, and Malaysia, home to many semiconductor packaging and testing facilities as well as passive component fabs, has now come under the international spotlight as a result In particular, Malaysia’s MCO 30 (Movement Control Order 30) lockdown, which was extended on June 1, specifically excludes the semiconductor industry, as this industry boasts relatively high market revenue As such, packaging and testing facilities are currently operating normally in Malaysia, according to TrendForce’s latest investigations On March 18, 2020, the Malaysian government first implemented similar pandemic control measures, under which only about 50% of private businesses were allowed to operate The semiconductor industry and medical services were notably excluded from the restrictions at the time, given the former’s high revenue and the latter’s critical importance during emergencies Despite the heightened lockdown of the MCO 30, under which only certain essential economic activities are allowed to function, some aspects of the MCO 30’s restrictions are relatively more lenient, as this policy specifies only 40% of private business employees must adopt WFH Incidentally, as previously mentioned, the MCO 30 does not apply to the semiconductor industry As manufacturing operations and lead times of passive components become constrained, end clients’ procurement activities remain uncertain in 2H21 On the other hand, TrendForce indicates that the passive component market, which is also a key industry in Malaysia, will likely face supply-side bottlenecks as a result of the MCO 30, affecting such suppliers as Taiyo Yuden, Walsin Technology, NDK, and Epson Under the latest restrictions, product lead times in the passive component supply chain, along with the state of the transportation industry (which determines shipping and delivery schedules of passive components), will become key determinants of whether client orders can be fulfilled on time In addition, brands in Europe and North America will begin adjust their orders for late-3Q21 in June and July Notebook brands including Dell and HP are not only expected to maintain their orders for 2H21, but also taking measures to ensure a steady supply of IC components, while Apple will begin procuring components for its upcoming iPhone 13 from the passive component supply chain in July Although these orders are expected to provide upward momentum for the passive component market in 2H21, the resurgence of the pandemic in Southeast Asia, as well as whether the shortage of semiconductor components will be alleviated going forward, will affect clients’ procurement activities for MLCC (multilayer ceramic capacitors) in 2H21 On the whole, although the packaging and testing operations of major IDMs (Intel, Infineon, and Texas Instruments) and OSAT operators (ASE, Amkor, TFME, and Hua Tian) in Malaysia remain unaffected for the time being, TrendForce believes that the MCO 30 will likely have an impact on the supply and demand of the global passive component market in 2H21 For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

Press Releases
Revenue of Top 10 Packaging/Testing (OSAT) Companies for 1Q21 Reaches US$7.17 Billion Thanks to Bullish Demand from End-Devices, Says TrendForce

2021/05/19

Semiconductors

Revenues of the top 10 largest packaging/testing (OSAT, outsourced semiconductor assembly and test) companies reached US$717 billion in 1Q21, a 215% increase YoY, with most of these companies recording double-digit growths, according to TrendForce’s latest investigations This bullish performance is primarily attributed to the fact that the post-pandemic new normal, which entails such activities as WFH and distance education, adopted by the general public had become commonplace, as well as the fact that vaccinations in Europe and North America began to somewhat abate the intensity of the pandemic in those areas, with cities successively terminating lockdown measures Furthermore, demand for IT products, TVs, 5G devices, and automotive electronics persisted given the impending Tokyo Olympics Finally, end-device manufacturers had been aggressively procuring components since 2H20, in turn leading to a tight production capacity for actors across the semiconductor supply chain Hence, OSAT companies gradually increased their prices in response to strong demand from clients Taken together, these aforementioned factors propelled the overall revenue performances from the OSAT industry in 1Q21 TrendForce indicates that clients in the end device markets are now worried that they may have to contend with last year’s chip shortage once again In addition, skyrocketing shipping costs and lead times have led these clients to consider overbooking their orders However, certain countries have been experiencing a slight slowdown in the pandemic’s spread after starting their vaccination drives, and governments in these countries have begun to gradually call off lockdown measures, thereby returning the state of work and study to pre-pandemic situations In light of these developments, TrendForce expects demand for end devices to be met ahead of time and potentially undergo a decline in 3Q21 Clients in the end device markets are then expected to either slow their procurement activities or cut their chip orders, and revenues of OSAT companies may be negatively impacted as a result Industry leaders ASE and Amkor posted revenues of $169 billion and $133 billion, which are YoY increases of 246% and 150%, respectively, in 1Q21 ASE gradually strengthened and increased the supply of its wire bonding services for chips used in notebook computers, telecom devices, and servers The company has been well prepared in terms of both mature and advanced chip packaging capacities On the other hand, Amkor, which took second place in the top 10, was primarily focused on developing its advanced packaging competencies and aggressively expanding its presence in the advanced packaging market for 5G, automotive, and notebook chips In comparison, SPIL and PTI recorded relatively slow revenue growths, mainly because their clients in 3Q20 were unable to immediately make up for the gap left by Huawei after it was added to the Entity List, and because clients in the memory industry had been adjusting their inventories during this period SPIL and PTI each recorded revenues of about $860 million and $650 million, which are YoY increases of 64% and 35%, respectively On the other hand, KYEC’s revenue for 1Q21 reached $270 million, a 152% increase YoY As KYEC gradually recovered from the impact of US sanctions against Huawei, the company’s revenue also remained in an upward trajectory With regards to the three Chinese heavyweights JCET, TFME, and Hua Tian, ongoing tensions between China and the US led the Chinese government to focus on cultivating the domestic manufacturing of semiconductors, such as automotive chips, memory products, 5G base station components, and panel driver ICs, all of which posed enormous demand for OSAT services As such, JCET and TFME grew their revenues by 263% YoY and 620% YoY to about $103 billion and $503 million, respectively, while Hua Tian also registered a revenue of $400 million for the quarter and delivered the highest growth among the top 10 at 649% YoY Chipbond, an OSAT company specializing in panel driver ICs, benefitted greatly from the surge in demand for large-sized panels (for TVs and IT products) and medium- and small-sized panels (for tablets and automotive displays), which generated high demand for COF (chip on film) packaging technology Alternatively, ChipMOS was able to capitalize on the recovering DRAM and NAND Flash demand Both Chipbond and ChipMOS posted a revenue of about $230, which is a 223% increase YoY for the former and a 273% increase YoY for the latter For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

Press Releases
Strong Growth Expected for Third-Generation Semiconductors in 2021, with GaN Power Devices Undergoing Highest YoY Increase in Revenue at 90.6%, Says TrendForce

2021/03/11

Semiconductors

The third-generation semiconductor industry was impaired by the US-China trade war and the COVID-19 pandemic successively from 2018 to 2020, according to TrendForce’s latest investigations During this period, the semiconductor industry on the whole saw limited upward momentum, in turn leading to muted growth for the 3rd gen semiconductor segment as well However, this segment is likely to enter a rapid upturn owing to high demand from automotive, industrial, and telecom applications In particular, the GaN power device market will undergo the fastest growth, with a $61 million revenue, a 906% YoY increase, projected for 2021 TrendForce expects three factors to drive the rapid growth of the GaN and SiC markets in 2021: First, widespread vaccinations are projected to drastically curb the spread of the pandemic, thereby galvanizing a stable increase in the demand for base station components, as well as for components used in industrial energy transition, such as power inverters and converters Secondly, as Tesla began adopting SiC MOSFET designs for its in-house inverters used in Model 3 vehicles, the automotive industry has started to place increasing importance on 3rd gen semiconductors Finally, China will invest enormous capital into its 14th five-year plan starting this year and expand its 3rd gen semiconductor production capacity to ultimately achieve semiconductor independence Resurging demand from EV, industrial, and telecom sectors will bring about a corresponding increase in 3rd gen semiconductor device revenue Although certain foundries, such as TSMC and VIS, have been attempting to manufacture GaN devices with 8-inch wafers, 6-inch wafers are still the mainstream As the pandemic shows signs of a slowdown, the demand for RF front end in 5G base stations, for smartphone chargers, and for automotive on-board chargers has now gradually risen As such, total yearly revenue from GaN RF devices is projected to reach US$680 million, a 308% increase YoY, in 2021, whereas GaN power device revenue is projected to reach $61 million, which is a 906% increase YoY In particular, the remarkable increase in GaN power device revenue can primarily be attributed to the release of fast chargers from smartphone brands, such as Xiaomi, OPPO, and Vivo, starting in 2018 These chargers enjoyed excellent market reception thanks to their effective heat dissipation and small footprint Some notebook computer manufacturers are currently looking to adopt fast charging technology for their notebook chargers as well Going forward, TrendForce expects more smartphone and notebook chargers to feature GaN power devices, leading to a peak YoY increase in GaN power device revenue in 2022, after which there will be a noticeable slowdown in its upward trajectory as GaN power devices become widely adopted by charger manufacturers On the other hand, 6-inch wafer capacities for SiC devices have been in relative shortage, since SiC substrates are widely used in RF front end and power devices TrendForce expects yearly SiC power device revenue to reach $680 million, a 32% increase YoY, in 2021 Major substrate suppliers, including Cree, II-VI, and STMicroelectronics, are planning to manufacture 8-inch SiC substrates, but the short supply of SiC substrates will unlikely be resolved until 2022 For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom

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