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keyword:Boyce Fan32 result(s)

Press Releases
Display Driver IC Price Hike May Persist in 4Q20 as Supply Remains Tight in 2H20, Says TrendForce

2020/09/08

Display

Given the high demand for display panels, a tight supply situation for DDI has begun to surface in 2H20, according to TrendForce’s latest investigations As prices of foundry services rose due to the tight supply of foundry capacity, IC suppliers’ DDI quotes to panel makers in turn also began rising in 3Q20 This uptrend in DDI quotes will potentially continue in 4Q20 Demand from WFH and distance education applications generated by the COVID-19 pandemic has benefitted the IT panel market and especially the NB panel segment, leading to a rising demand for DDI On the other hand, new electronic product applications have taken up an increasing allocation of 8-inch foundry capacities in the past year In particular, 5G smartphones require double or even triple the number of PMICs used in 4G smartphones As foundry capacity for DDI becomes more and more constricted, DDI suppliers have resorted to accepting the higher quotes from foundries in order to ensure a sufficient level of wafer capacity as other products are also competing for foundries’ limited capacities High demand for entry-level and mid-range phones led to HD TDDI shortage in 3Q20 TDDI IC for small-sized displays also went into a shortage in 3Q20, primarily because of the massive increase in demand for entry-level and mid-range HD smartphones Because the HD smartphone segment is highly cost-sensitive, these smartphones place a high demand for foundries’ 12-inch 80nm production capacities However, some foundries are in the midst of transitioning some of their wafer capacities from the 80nm node to the 55nm node, leading to a severe shortage in the supply of 80nm TDDI and subsequently driving up IC prices Tablet TDDI demand results in further shortage of wafer capacity for DDI On the other hand, as tablet panels began integrating TDDI In-Cell solutions on a massive scale this year, the demand for TDDI IC used exclusively for tablet panels has gradually risen as well, occupying some of the 80nm production capacities at foundries Since the TDDI IC ASP of tablet panels is higher than that of smartphone panels, wafer input for the former product is further exacerbating the foundry capacity shortage situation for the latter product Production capacity made available due to Huawei sanctions is insufficient to reverse the tight capacity supply situation The recently expanded sanctions against Huawei by the US government will have dire ramifications on Huawei’s smartphone manufacturing next year TrendForce believes that, although Huawei’s inability to order wafer starts can indirectly alleviate the tight wafer capacity of some foundries, 8-inch and 12-inch wafer capacities on the whole are expected to remain tight despite the extra foundry capacity made available in Huawei’s absence This shortage in 8-inch and 12-inch wafer capacity can mostly be attributed to the growing demand for 5G smartphone components With regards to the supply of large-sized DDI, in the short run, IC suppliers will have to accept the price hike of foundry services, while this increased price will be transferred to panel makers as well At the same time, IC suppliers will also investigate the possibility of transitioning the manufacturing process for NB panel DDI from the 8-inch 01xµm process node to the 12-inch 90nm node In terms of small-sized TDDI, however, as the supply of 12-inch 80nm capacity remains tight going forward, FHD TDDI manufacturing will transition to the 12-inch 55nm node instead Finally, the lack of 80nm capacity means IC suppliers must transition their HD TDDI to the 12-inch 55nm node in order to maintain the supply of HD TDDI

Press Releases
Issues of Tight Supply of DDI to Persist in 2H20, Potentially Becoming Long-Term Concern, Says TrendForce

2020/06/18

Semiconductors / Display

According to the latest investigations by the WitsView research division of TrendForce, foundries have maintained a high level of capacity utilization in 1H20 in spite of disruptions caused by the COVID-19 pandemic In particular, the node capacities of mainstream process technologies used for DDI production are showing a tight supply situation that is unlikely to be alleviated even in 2H20 There is a high possibility for foundry capacities allocated for DDI production to be compressed by other applications in 2H20, in turn potentially resulting in a price hike for DDIs TrendForce indicates that demand from large-sized DDI wafer input has remained relative stable despite drastic changes in the demand for display panels since the onset of COVID-19 in early 2020 While most IC applications are produced at 8-inch fabs, specifically at their 01X µm process nodes, foundries have not expanded their 8-inch capacities by a significant amount As such, DDI manufacturers had to maintain their level of wafer input orders at foundries out of necessity, driven by the possibility that, once they reduced their levels of wafer input, they would be unable to subsequently recover their originally assigned production capacity at foundries after DDI demand ramps up later on Even so, IT panel demand underwent a sudden surge in 2Q20, and manufacturers could not supply enough DDI to meet the rising IT panel demand even though DDI manufacturers attempted to adjust their existing product mix given their assigned wafer capacities at foundries Therefore, the issue of tight supply yet remains an unresolved problem for large-sized DDI manufacturers The demand for smartphones has plummeted considerably owing to the pandemic’s impact, with certain smartphone brands reacting to this market slump in the short term by extending the lifecycle of older smartphone models or expanding the lineups of entry-level and mid-range models, in turn slowing down the pace of mainstream TDDI IC process technology’s transition from the 80nm node to the 55nm node for 12 inch wafers Case in point, most smartphone brands have decided to continue using TDDI ICs manufactured with 80nm process technology and slow down their plans of transitioning to 55nm TDDI ICs (such as high frame rate TDDI ICs) due to cost concerns and a slowdown in the mass production of new smartphone models With regards to new specifications of 55nm TDDI ICs, although R&D and mass production plans are still underway, they have now taken a more gradual pace TrendForce’s observations find that, as foundries continue to scale down their 6-inch wafer capacities, client demand has been increasingly focused on 8-inch production capacities In addition, the surging demand for emerging applications, including 5G applications, PMIC, fingerprint recognition, and CMOS sensors, has led to an increasingly tight supply situation for foundries’ 8-inch production capacity Since wafer input for these emerging applications is much more profitable than for DDI, foundries generally prioritize the allocation of their limited production capacity for the former instead of the latter The production capacity allocated to DDI is thus expected to become more and more compressed as a result Additionally, as 8-inch production capacities are unlikely to be increased in the future, their tight supply may become a long-term structural issue, further compressing the production capacity of DDI and putting pressure on IC prices to go into an uptrend In other words, the size of DDI clients’ wafer input orders and the relationship between foundries and DDI clients are both key factors determining whether DDI manufacturers can obtain a consistent supply of wafer capacity at their respective foundries Likewise, the 80nm node capacities of 12-inch fabs are undergoing constant cutbacks as well Some foundries are demanding their TDDI clients to migrate their wafer input orders from the 80nm node to the 55nm node due to the latter’s superior profitability; TDDI manufacturers will thus be forced to contend with the corresponding adjustment of production capacities and seek out replacement solutions as a risk mitigation measure However, TrendForce expects the foundries’ 80nm capacities, which are less costly and more technologically mature than 55nm ones, to remain an increasingly sought-after node for TDDI manufacturers, since smartphone brands will in the short run focus on entry-level and mid-range models, which have higher potential for sell-through in the market

Press Releases
Penetration Rate of AMOLED Smartphones Expected to Reach 35.6% in 2020 as Brands Increase Panel Adoption, Says TrendForce

2020/05/07

Display / Consumer Electronics

According to the latest investigations by the WitsView research division of TrendForce, the spread of the COVID-19 pandemic has diminished the global production of smartphones and also affected the market shares of different display panel technologies used in smartphones As smartphone brands are proactive in adopting AMOLED panels for their phones, the penetration rate of AMOLED phones in the overall smartphone market is still projected to increase from 310% in 2019 to 356% in 2020 On the other hand, the penetration rate of TFT-LCD phones (including those with LTPS or a-Si panels) is projected to undergo a yearly decrease The growing influence of Chinese panel manufacturers will likely result in China occupying 35% of global AMOLED production capacity in 2020 TrendForce Research Director Boyce Fan indicates that most smartphone brands are implementing AMOLED panels for their flagship models in 2020 Case in point, all of Apple’s new phones to be released in 2H20 are expected to adopt AMOLED panels Therefore, although the current forecasted 356% penetration rate of AMOLED smartphones is lower than the pre-pandemic forecast of 377%, it still exceeds the 310% penetration rate seen in 2019 Furthermore, newly added production capacity of AMOLED panels is expected to continue increasing, in particular the production capacity of Chinese panel manufacturers, which are expected to account for 35% of global AMOLED panel capacity by area in 2020, a significant increase from 26% in 2019 Chinese panel manufacturers will likely look to increase their capacity utilization and yield rates in order to grow their influences and become part of major smartphone brands’ supply chains For the past two years, the industry has seen a slowdown in the expansion of LTPS panel capacity, accompanied by a corresponding stabilization of panel supply Because of their hypercompetitive prices, narrow borders, and low power consumption, LTPS panels have gradually become the mainstream choice for smartphone displays, thus forcing a-Si panels into the entry-level market However, the surge of AMOLED panel supply is already starting to erode the shares of LTPS panels in the mid-range and high-end smartphone markets In addition, as the pandemic’s impact on the smartphone market is gradually manifesting, smartphone brands are leaning towards lengthening the shelf time of older models or even increasing the number of entry-level phones, in turn damaging the presence of LTPS phones in the mid-range segment The market share of LTPS phones is expected to fall from 402% in 2019 to 378% in 2020, but the magnitude of this decrease somewhat surpasses the expected drop for a-Si phones, which are projected to see a decrease in market share from 288% in 2019 to 266% in 2020 The presence of AMOLED phones in the smartphone market will continue to expand in the long run, with AMOLED phones eventually becoming the mainstream while crowding out the shares of TFT-LCD (including LTPS and a-Si) phones That means LTPS panel manufacturers, whose production capacity primarily focused on smartphones, must look to other revenue drivers, including notebook computer panels, tablet panels, or automotive display panels, to maintain their capacity utilization rates

Press Releases
As Tight Supply of DDI Becomes Imminent in 2020, TDDI Manufacturing Moves to More Advanced Process Technologies, Says TrendForce

2019/12/12

Display / Semiconductors

According to the latest analysis from the WitsView research division of TrendForce, as electronic device manufacturers start to develop product strategies for the 2020 market driven by the commercialization of 5G technology, foundries are likewise raising their capacity utilization rates Specifically, 8-inch and 12-inch wafer fabs of large foundries are estimated to reach near-maximum production capacities in 4Q19, thus compressing the supply of large-sized DDI and small-sized TDDI TrendForce research director Boyce Fan indicates that while most large-sized DDIs were previously produced at several different process nodes (03-02µm, 01Xµm), following two to three years of production shift, they are now primarily produced at 01Xµm nodes in 8-inch fabs Foundries are starting to compress the initial supply of DDI, however, in favor of meeting the recent demand for more profitable products, such as fingerprint sensors, power management IC, and entry-level CMOS sensors The current market for large-sized panels faces the dual problem of both oversupply and weak demand in the off-season But these factors are expected to be counterbalanced as panel manufacturers adjust their production capacities, and TV panel ASP bottoms out TrendForce forecasts the possibility of tight supply in the 1H20 large-sized DDI market once client demand starts to skyrocket Because there were significant supply shortages of smartphone TDDI in 1H18, IC manufacturers began migrating their TDDI process nodes from 80nm nodes to 55nm nodes in an effort to mitigate supply risks However, most clients have been unwilling to adopt HD Dual Gate and FHD 6MUX TDDI, both produced at 55nm nodes in 2019, because the former suffered from product certification issues, while the latter yielded subpar product performance As a result, most cellphones still contain 80nm TDDI chips On the other hand, as China-based AMOLED panel manufacturers entered the mass production stage, the demand for OLED DDI began to soar IC manufacturers are expected to concentrate their production capacity on 40nm and 28nm processes in 2020 As some of the foundries increase the production of 40nm and 28nm process nodes, their production capacity at the 80nm node is likely to undergo a corresponding decline due to equipment constraints, in turn decreasing their TDDI production IC manufacturers are expected to begin producing TDDI at the 55nm nodes to compensate for the decline in TDDI production in 80nm nodes again Rising market penetration rate of high frame rate phones can help mitigate potential risks in TDDI supply Because high-bandwidth 5G services are starting to become more widespread, and the esports industry is undergoing significant growth, smartphone brands consider high frame rate display panels (90Hz+) to be the primary differentiator of smartphone specifications in 2020 As well, IC manufacturers are restarting the production of 90Hz/120Hz TDDI ICs at their 55nm process nodes in hopes of integrating these ICs in TFT-LCD-equipped phones In addition to TFT-LCD-equipped phones, 90Hz displays are also starting to become a major selling point in newer, AMOLED-equipped flagship models TrendForce projects that high frame rate phones are expected to exceed a 10% market penetration rate, with the possibility of becoming the industry standard in flagship phones As the market continues to rapidly mature, high frame rate phones can help mitigate the potential risks involved in TDDI supply for IC manufacturers in 2020

Press Releases
Demand for AMOLED-Equipped Cellphones to Continue Rising in 2020, LTPS to Remain Mid-Range Favorites, Says TrendForce

2019/10/24

Display / Consumer Electronics

According to the latest analysis from the WitsView research division of TrendForce, the share of devices featuring AMOLED panels is expected to grow from 328% in 2019 to 380% in 2020 in the global smartphone marketplace, in response to an ever-increasing production capacity and smartphone makers' willingness to adopt the technology In contrast, the market share of LTPS-equipped devices is expected to drop from 413% down to 386% The market shares for AMOLED- and LTPS-equipped devices are roughly even, with the former possibly taking the lead in the future Boyce Fan, research director at TrendForce, argues that AMOLED panels are able to establish dominance in the high-end smartphone market because of increased adoption by smartphone makers, owing to Samsung Display's successful pricing strategies; furthermore, AMOLED is the only panel technology that enables integration of under-display fingerprint sensors Aside from Samsung and Apple, the largest smartphone makers in China are aggressively incorporating AMOLED panels into their product lines, in turn accelerating the expansion of Chinese panel manufacturers' AMOLED production capabilities Most of China's growing AMOLED production capacity is dedicated to flexible AMOLED panels As a result, Samsung Display controls the vast majority of global rigid AMOLED production The maturity of rigid AMOLED technology, combined with its superior cost and yield, makes it Samsung's weapon of choice in the fight for market shares, with the implication of reduced mid-range and high-end smartphone LTPS panel shares TrendForce holds the opinion that, given the constant production capacity of rigid AMOLED panels, should demand increase in 2020, the supply and demand of rigid AMOLED panels will present a balanced or slightly tight market, since Chinese flexible AMOLED production is as of yet uncompetitive On the other hand, LTPS panels, which once occupied the mid-range and high-end smartphone segments, are now facing an adverse market economy stemming from hypercompetitive prices As such, profit margins are significantly reduced for panel manufacturers However, with bezel-less phones becoming the norm in 2019, production speed for Dual Gate TDDI-equipped a-Si HD In-Cell panels is failing to match projected figures This creates a point of market entry for LTPS panels and an incentive to transform production capacity towards the development of LTPS HD devices, in turn making up for lost high-end market shares in the low-end and mid-range markets As well, LTPS manufacturers without a reliable customer base are starting to adapt by closing down non-essential production lines and moving towards non-smartphone applications of LTPS panels to alleviate pressure from reduced LTPS demand caused by competition from AMOLED makers  TrendForce projects a growth in the demand for flexible AMOLED panels, which will effect a further increase in the global market shares of AMOLED-equipped smartphones In contrast, rigid AMOLED panels have limited growth potential due to supply limitations It remains to be seen whether LTPS panels can fill the gap left by unfulfilled demand for rigid AMOLED panels, and whether this allows LTPS supply and demand to reach a healthy equilibrium

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