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keyword:Avril Wu142 result(s)

Press Releases
DDR3 Consumer DRAM Prices Expected to Rise by 0-5% in 2Q22 Due to Rapidly Shrinking Supply, Says TrendForce

2022/03/07

Semiconductors

Intel and AMD will be releasing new CPUs that support DDR5 DRAM solutions for PCs and servers this year In response, the DRAM industry led by South Korean suppliers is developing solutions to complement the arrival of the new CPUs In the midst of the gradual shift to DDR5, DRAM suppliers will also scale back the supply of DDR3 solutions, according to TrendForce’s latest investigations With Korean suppliers accelerating their withdrawal from DDR3 production, Taiwanese suppliers yet to kick off mass production using newly installed capacities, and Chinese suppliers falling short of their expected yield rate, the global supply of DDR3 solutions will undergo an impending decline With respect to the demand side, however, not only has the supply of networking chips been ramping up, but material shortage issues are also gradually easing As such, buyers are now procuring DDR3 solutions ahead of time, resulting in a tight supply and demand situation in the DDR3 market TrendForce therefore expects DDR3 DRAM prices to recover from a bearish first quarter and undergo a 0-5% QoQ increase in 2Q22 On the supply side, Samsung and SK hynix have begun scaling back their DDR3 production while also planning to declare EOL (end of life) for their DDR3 offerings, such as 1/2Gb and 4Gb chips It should be noted, however, that Micron’s DDR3 solutions will not reach EOL even by 2026, meaning the company will still offer DDR3 solutions long after its two Korean competitors have stopped doing so, according to TrendForce’s understanding Also worth noting is that Micron is migrating its DDR3 production to a US-based fab that mainly manufactures specialty DRAM solutions Nevertheless, since this fab’s production capacity will be divided between products for consumer and automotive applications, TrendForce believes that the aforementioned migration will tighten Micron’s supply of consumer DRAM solutions because the US fab will give priority to automotive DRAM solutions that offer a higher gross margin and are currently enjoying surging demand Although Taiwan-based DRAM suppliers that focus on promoting DDR3 solutions, namely, Nanya Tech and Winbond, are in the process of capacity expansion, their new production lines will not be operational until 2023-2024 Hence, the contribution from the newly added capacities is not expected to drive up DDR3 supply substantially this year Chinese suppliers, including CXMT and GigaDevice, are continuing to collaborate in DDR3 development, though their capacity increases and yield rate improvements have both fallen short of market expectations After being added to the Entity List, JHICC, yet another China-based DRAM supplier, is now dealing with severe restrictions with respect to procuring equipment, making it difficult for JHICC to raise its wafer input Furthermore, the company has no spare resources that can be allocated to R&D and pilot runs As a result, JHICC still primarily manufactures DDR4 4Gb chips at its initial 25nm node, with no DDR3 production at the moment With regards to demand, DDR3 consumer DRAM is primarily used in end-devices such as STBs and networking products (eg, GPON, routers, and modems), which do not require high-performance SoCs While the foundry industry suffered a severe shortage of wafer capacities allocated to logic ICs in 4Q21, production capacities for relatively low-margin chips were noticeably impacted in turn Along with a preexisting component mismatch situation, most manufacturers found themselves unable to assemble end-devices Moving into early 2022, however, the supply of certain materials, including those used in foundry operations, saw a gradual improvement As various components needed for device manufacturing became available after Lunar New Year, certain buyers have once again kicked off their consumer DRAM procurement activities In addition, DRAM spot prices shifted from a prior decline to a strong upturn at the end of last year as the Chinese government ordered a month-long lockdown in Xi’an The ensuing price hike, which has lasted for two months, subsequently led buyers to procure even more DRAM ahead of time in anticipation of further price hikes Hence, although the demand for end-products has yet to make a full recovery, buyers are now slowly and steadily procuring consumer DRAM in order to avoid either higher upcoming prices or even an inability to secure consumer DRAM inventory For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

Press Releases
Overall DRAM Output Decreased Nearly 6% QoQ in 4Q21 Due to Decline in Shipments and Pricing, Says TrendForce

2022/02/17

Semiconductors

The pandemic has impeded the supply of many end-user devices such as smartphones, servers, PCs, and niche consumer electronics components, indirectly leading to a decline in a willingness on the procurement-end to stock relatively abundant memory chips, according to TrendForce research This is most obvious in the stance of PC OEMs holding more than 10 weeks or more of DRAM inventory Therefore, most DRAM fabs experienced a drop in shipments in the fourth quarter of 2021 and declining purchasing momentum has also led to a downward trend in DRAM price quotations Total 4Q21 DRAM output value decreased by 58% QoQ, reaching US$2503 billion, with only a few suppliers such as SK hynix bucking this trend Looking forward to 1Q22, although material shortages for some components can be alleviated, the first quarter is already an off season for demand and buyers’ inventories are still flush Thus, the purchasing-side will largely concentrate on destocking, with overall purchasing momentum remaining sluggish Thus, DRAM pricing in the first quarter of this year is expected to face greater pressure than in the fourth quarter of last year and overall DRAM output value may fall further 4Q21 DRAM price drop causes downturn in manufacturer profit levels In terms of revenue performance, price quotations from the three major DRAM manufacturers all declined with slightly differing shipments trends Shipments from both Samsung and Micron fell due to poor end-user demand, with revenue down 9% and 8%, respectively In terms of market share, Samsung dropped slightly to 423% while still ranking first, SK hynix climbed to nearly 30%, ranking second, and Micron dropped slightly to 223%  Pricing gaps between these three DRAM manufacturers in 1Q22 is expected to be narrow, but since SK hynix had a relatively high base period of shipment in the 4Q21, the company expects a decline in its shipments slightly higher than the industry average which will reduce its 1Q22 market share slightly In terms of profit performance, the operating profit margins of Samsung, SK hynix, and Micron (September-November financial reporting) fell to 50%, 45%, and 41%, respectively, due to the cost optimization resulting from an increase in the proportion of advanced processes not being  enough to make up for the decline in price quotations TrendForce believes that the downturn trend in profit margins is likely to intensify in 1Q22 and DRAM suppliers will face sharper profit decline Manufacturers can only increase the proportion of advanced processes and optimize their product portfolio to reduce the impact brought on by price pressure  Specialty DRAM market conditions also weak in 4Q21, with Taiwanese manufacturer revenue falling as well As the demand for specialty DRAM end-user applications such as TVs and consumer electronics products dropped significantly in 4Q21, coupled with the impact of material shortages in the supply chain, client demand for DRAM shipments also cooled substantially The 4Q21 specialty DRAM price decline was also comparable to that of mainstream products, in turn impacting the revenue performance of Taiwanese manufacturers focused mainly on the consumer market From the perspective of Nanya Tech, the combination of falling volume and price reduced its revenue in 4Q21 by approximately 10%, while its operating profit rate fell to 375% due to the decline in price quotations Winbond's small-capacity (1/2Gb) market was also affected by components mismatch issues, but the impact was relatively small and its 4Q21 revenue fell slightly by close to 4% PSMC’s (revenue calculation is primarily based on its self-produced standard DRAM products and does not include its DRAM foundry business) revenue fell slightly by approximately 1% If its foundry revenue is added, then its revenue grew by 6%, reversing a downward trend This demonstrates that locking-in long-term contracts early is a good strategy Faced with reversal in the DRAM market, it is TrendForce’s understanding that the solutions of the three major Taiwanese manufacturers are as follows: Nanya Tech can allocate 20nm production capacity to produce DDR3 (better gross profit) when DDR4 market conditions are poor and invest more resources in the research and development of new 1X nm processes  If yield improves rapidly, this will provide some contribution before the completion of its new factory in 2024 In addition to continuing to focus on niche small-capacity products, Winbond is also strengthening research and development of 25 nm and next-generation 20 nm products, expected to be introduced directly when its Kaohsiung Lujhu factory starts mass production As for PSMC, by locking clients into long-term contracts, it can plan 2022 production in advance and continue to maximize its greatest advantages In accordance with market conditions and gross profit levels, it will allocate production capacity between logic IC and memory products For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

Press Releases
NAND Flash Pricing Set to Spike 5-10% in Q2 Due to Material Contamination at WDC and Kioxia, Says TrendForce

2022/02/10

Semiconductors

WDC recently stated that certain materials were contaminated in late January at NAND Flash production lines in Yokkaichi and Kitakami, Japan which are joint ventures with Kioxia, according to TrendForce’s investigations Before this incident, TrendForce had forecast that the NAND Flash market will see a slight oversupply the entire year and average price from Q1 to Q2 will face downward pressure However, the impact of WDC’s material contamination issue is significant and Samsung’s experience during the previous lockdown of Xi'an due to the pandemic has also retarded the magnitude of the NAND Flash price slump  Therefore, the Q1 price drop will diminish to 5~10% In addition, according to TrendForce, the combined WDC/Kioxia NAND Flash market share in the 3Q21 was as high as 325% The consequences of this latest incident may push the price of NAND Flash in Q2 to spike 5~10% The contaminated products in this incident are concentrated in 3D NAND (BICS) with an initial estimate of 65exabytes (approximately 6,500M GB) affected According to TrendForce, damaged bits account for 13% of the group's output in 1Q22 and approximately 3% of the total output for the year The normal production schedule for the entire line has yet to be confirmed It is worth noting that the damages announced by WDC likely do not account for total losses stemming for this event and the number of damaged Kioxia parts has not been aggregated, so the total number of affected bits may increase further Production primarily focused on Client SSD and eMMC, subsequent spot pricing may climb Currently, WDC and Kioxia are focused on supplying PC client SSD and eMMC products Since WDC is the number two and number one supplier in the client SSD and eMMC markets, respectively, subsequent supply will inevitably be hampered Therefore, even if production demand for PC OEM is revised downward in Q2, client SSD prices may remain resistant to decline In terms of enterprise SSD, Kioxia PCIe 40 has been verified by a number of customers and the company's market share in 2022 was originally forecast to increase However, this incident will impact Kioxia’s ability to ship product and further affect subsequent customer procurement Therefore, in order for buyers to satisfy their own production requirements, a Q2 decline in enterprise SSD product pricing will be largely restrained In addition, as buyers and sellers in the spot market are still clarifying events and incident assessments, they mostly responded by suspending quotations, with no new quotations having been generated However, TrendForce’s assessment indicates that subsequent events will obviously stimulate spot price appreciation Judging from contract pricing, any orders negotiated on a whole quarter basis should be unaffected in the near-term but there may be an immediate price increase in wafer quotations this February and March For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

Press Releases
Impact of Components Shortage on Whole Device Shipments Continues, PCs and Notebooks Least Affected, Says TrendForce

2022/01/10

Semiconductors

Driven by forces such as the pandemic, geopolitics, and the digital transformation of everyday life, there has been a shortage of global foundry production capacity for nearly two years and shortages have been especially severe for mature 1Xnm~180nm nodes, according to TrendForce’s investigations Although all foundries are furiously increasing capital expenditures to expand capacity, unrealized future expansion does not ease existing supply issues In addition, the uneven distribution of supply chain resources that has exacerbated the shortage of parts and components has yet to be definitively alleviated Circumstances as a whole will continue affecting shipments of related whole devices Only the PC category is expected to emerge largely unscathed in 1Q22 Moving into 1Q22, TrendForce states, due to the limited increase in production capacity, the market's supply situation is expected to be approximately the same as in 4Q21 However, some end products have entered their traditional off-season cycle and the slowdown in demand momentum is expected to alleviate the immediate pressure on OEMs and ODMs regarding supply chain stocking In terms of the whole servers, the FPGA delivery cycle is currently at over 50 weeks at most, while the delivery cycle of Lan chips has improved significantly, from the original 50+ weeks to approximately 40 weeks However, escalating purchase order activity caused by the uncertainty of the pandemic combined with an accumulated backlog of demand (Back order/backlog) have pushed the SMT capacity of ODMs to full load in general The aforementioned phenomenon have not only accelerated the consumption of ICs such as FPGA and PMIC, but the demand for additional purchase orders of FPGA, PMIC and MOSFET is still compelling The overall market remains tight and the production of server motherboards in the future may face hidden issues TrendForce has ascertained a more crucial matter Taking the L6 server as an example, its production scale in 1Q22 will be roughly the same as the previous quarter However, whole server shipments will show a seasonal decline with a decrease of approximately 8% QoQ  In terms of mobile phones, material shortages have gradually eased from the second half of 2021 partly due to the discretionary adjustment of mobile phone specifications Mobile phone brands can adjust their specifications and configurations based on available materials Currently, the supply of four components remains relatively tight Among them, 4G SoC (30-40 weeks) and OLED DDIC/Touch IC (20-22 weeks) have a significant impact on the market The former will affect brands that focus on selling 4G mobile phones The latter is affected by oligopolistic market structure and the adjustment of foundry capacity Thus, there are rumblings of insufficient supply Though the supply of the remaining two items, PMIC and A+G Sensor, remains tight, material shortage risk can be largely mitigated through alternative material replacements or the adjustment of specifications and configurations In terms of production, the 1Q22 supply chain will essentially carry on its performance from the previous quarter However, due to disappointing holiday demand at the end of 2021, mobile phone brands must adjust the distributed inventory level of finished products in a timely manner Combined with uncertainty caused by disruptions stemming from a winter-time pandemic, 1Q22 production performance is estimated to fall by approximately 13% QoQ In terms of PCs and laptops, starting from November 2021, material shortages have been partially alleviated Therefore, the shipment volume of PC ODMs in 4Q21 has been revised upwards Compared with mobile phones and whole servers, the impact of under/oversupply of materials on end PCs and notebooks is relatively minor Except for the SSD PCIe 30 controller, current tightness exhibited in component supply is due to delays in the transition of Intel’s new platform This temporary shortfall has led to a delivery cycle of approximately 8-12 weeks while any tightness in the supply of Type C IC, WiFi, and PMIC is gradually abating TrendForce expects that, as overall supply chain stability recuperates, notebook shipments from ODM brands in 1Q22 will only decrease by 51% QoQ However, if the component shortage factor is discounted, subsequent sales originating from various distribution channels will be another major variable TrendForce must consider For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

Press Releases
Fire at ASML’s Berlin Plant May Impact EUV Optical Component Supply, Says TrendForce

2022/01/05

Semiconductors

A fire occurred at ASML’s factory in Berlin, Germany on January 3, according to TrendForce’s investigations ASML is the largest supplier of key equipment (including EUV and DUV) required for foundry and memory production According to TrendForce’s preliminary inquiry, approximately 200m2 out of a factory floor covering 32,000m2 was affected by the fire This factory primarily manufactures optical components used in lithography systems such as wafer tables, reticle chucks, and mirror blocks Reticle chucks used for affixing photomasks are in short supply Currently, the majority of components produced at this factory go towards supplying EUV machines while the lion’s share of demand for these products come from foundries If the fire delays component delivery, it cannot be ruled out that ASML will prioritize the allocation of output towards fulfilling foundry orders Lead time for this exclusive supply of key EUV machines has been long and may affect the timeframe of advanced manufacturing process transition   In terms of foundries, EUV is primarily used in advanced manufacturing processes smaller than the 7nm node Currently, the only companies in the world using this equipment for manufacturing are TSMC and Samsung including TSMC’s 7nm, 5nm, 3nm nodes, Samsung's EUV Line (7nm, 5nm and 4nm) built in Hwaseong, South Korea, and 3nm GAA node However, due to factors such as the shortage of global foundry production capacity and the active expansion of manufacturing, semiconductor equipment lead times are also stretching further into the future In terms of DRAM, Samsung and SK Hynix are already using EUV in their 1Znm and 1alpha nm processes, while US manufacturer Micron is expected to introduce EUV to their 1gamma nm process in 2024 According to TrendForce's current information, the lead time on ASML EUV equipment is approximately 12 to 18 months Due to this long equipment lead time, ASML is at liberty to wait for the completion of replace components for those lost in the fire during the time necessary for equipment assembly Overall, the ASML Berlin factory fire will have a greater impact on the manufacturing of EUV lithography equipment when it comes to foundries and memory According to TrendForce’s information, it cannot be ruled out that ASML will obtain necessary components from other factory campuses In addition, the current lead time for EUV equipment is quite long Therefore, the actual impact on EUV supply remains to be seen For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms Latte Chung from the Sales Department at lattechung@trendforcecom For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insidertrendforcecom/

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