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    <title>Global Market Intelligence &amp; Consulting | TrendForce</title>
    <link>https://www.trendforce.com</link>
    <description>TrendForce offers hi-tech industry research reports, including market bulletins, industry analysis and price trends, helping businesses tackle global challenges</description>
    <language>en-us</language>
    <lastBuildDate>Wed, 17 Jun 2026 15:39:58 +0800</lastBuildDate>
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            <title>TSMC Accelerates CoPoS Development; Taiwan Panel Makers and Local Materials and Equipment Suppliers Leverage FOPLP for Glass Core Substrate Opportunity, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260617-13107.html</link>
            <description><![CDATA[The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry. TrendForce reports that TSMC is currently focusing on its Chip-on-Panel-on-Substrate (CoPoS) packaging architecture and has standardized on a 310 × 310 mm panel format.]]></description>
            <pubDate>Wed, 17 Jun 2026 14:27:46 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260617-13107.html</guid>
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            <title>CSP In-House ASIC Boom Drives MLCC Specification Concentration; Structural Shortages of High-End Specialty MLCCs May Emerge in 2H26, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260617-13105.html</link>
            <description><![CDATA[According to TrendForce’s latest MLCC industry research, the ongoing AI arms race among global CSPs is accelerating the adoption of in-house ASIC accelerators, which increasingly rely on small-form-factor, high-capacitance, high-temperature-resistant MLCCs. As such, demand is rapidly concentrating on a limited number of premium specifications. However, with supplier capacity expansion lagging behind demand growth, the risk of structural shortages in the second half of 2026 is becoming increasingly difficult to ignore.]]></description>
            <pubDate>Wed, 17 Jun 2026 13:23:06 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260617-13105.html</guid>
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            <title>Contract Prices Surged More Than 100% in 1H26; Structural Shortages to Keep NOR Flash and SLC NAND Prices Rising in 2H26, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260616-13102.html</link>
            <description><![CDATA[Major memory suppliers continue to prioritize capacity allocation toward higher-value products such as HBM and advanced-layer 3D NAND, according to TrendForce’s latest research on the memory industry. This has squeezed the mature-node capacity for NOR Flash and SLC NAND.]]></description>
            <pubDate>Tue, 16 Jun 2026 14:30:52 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260616-13102.html</guid>
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            <title>Optical Interconnects Become Critical to AI Factory Expansion; CPO/NPO Market Expected to Exceed US$39 Billion by 2030, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260615-13098.html</link>
            <description><![CDATA[TrendForce’s recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, higher rack densities, and larger clusters. As data transfer becomes a major energy drain, CSPs are treating interconnect technologies as equally important as compute hardware. The architecture of interconnects now plays a key strategic role in determining AI factory growth, energy efficiency, and supply chain management.]]></description>
            <pubDate>Mon, 15 Jun 2026 15:40:35 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260615-13098.html</guid>
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            <title>Strong AI Demand and Early Consumer Electronics Inventory Build Drive Top 10 Foundries to 3.7% QoQ Revenue Growth in 1Q26, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260612-13095.html</link>
            <description><![CDATA[TrendForce&#039;s latest investigation into the foundry industry reveals that strong shipments of AI HPC chips and related components continued throughout 1Q26. Meanwhile, TV and PC/notebook supply chains accelerated production schedules and increased inventory levels for peripheral ICs, prompting foundries to receive pull-in orders and additional customer bookings.]]></description>
            <pubDate>Fri, 12 Jun 2026 14:58:39 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260612-13095.html</guid>
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            <title>AI Agent Boom Triggers Enterprise SSD Supply Crunch; Top Five Enterprise SSD Brands Post Record US$18.46 Billion Revenue in 1Q26, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260611-13092.html</link>
            <description><![CDATA[TrendForce’s latest analysis of the enterprise SSD market reveals that rapid adoption of AI Agent services and strong procurement demand from CSPs drove enterprise SSD revenue to another record high in 1Q26. Industry revenue surged 86.1% QoQ, surpassing US$18.46 billion.]]></description>
            <pubDate>Thu, 11 Jun 2026 14:21:56 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260611-13092.html</guid>
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            <title>NVIDIA Cuts Vera CPU Memory Configuration, Highlighting Persistent LPDRAM Supply Constraints and Rising Long-Term Demand, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260610-13090.html</link>
            <description><![CDATA[NVIDIA has decided to halve the SOCAMM memory capacity of its next-generation Vera Rubin Superchip modules, according to TrendForce’s latest findings. This adjustment does not reflect a reduction in NVIDIA’s overall memory demand. Rather, it is a response to insufficient LPDRAM capacity allocated to NVIDIA under its suppliers’ preliminary 2027 production plans.]]></description>
            <pubDate>Wed, 10 Jun 2026 14:27:41 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260610-13090.html</guid>
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            <title>NVIDIA Joins the Windows on Arm Ecosystem, Driving Arm-Based AI Notebook Penetration to 34.2% by 2029, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260604-13081.html</link>
            <description><![CDATA[TrendForce’s latest research reveals that the current AI notebook market is primarily driven by Intel, AMD, Apple, and Qualcomm. However, as it stands, the industry still lacks products capable of fully demonstrating the value of on-device AI computing at scale and creating compelling upgrade incentives for consumers.]]></description>
            <pubDate>Thu, 04 Jun 2026 14:57:54 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260604-13081.html</guid>
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            <title>AI Data Center Expansion to Drive Combined Monthly Capacity of EML and CW-DFB LDs to 50.7 Million Units in 2026, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260603-13077.html</link>
            <description><![CDATA[The rapid expansion of AI data centers and the intensifying race for AI computing power are accelerating the transition toward transmission speeds above 1.6 Tbps, according to TrendForce’s latest research. Major players such as NVIDIA, Google, and Meta are securing a stable supply by strategically locking in production capacity from electro-absorption modulated laser (EML) and continuous-wave distributed feedback laser diode (CW-DFB LD) suppliers.]]></description>
            <pubDate>Wed, 03 Jun 2026 13:29:30 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260603-13077.html</guid>
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            <title>Tight DRAM Supply Gives Suppliers Greater Pricing Power in HBM, with HBM Contract Prices Expected to Surge Multiples Higher in 2027, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260602-13074.html</link>
            <description><![CDATA[Sharp increases in conventional DRAM prices since the second half of 2025 have reflected an increasingly tight supply-demand environment. However, the annual pricing mechanism adopted by the three major suppliers for HBM has prevented contract prices from fully reflecting quarterly market price increases in a timely manner, according to TrendForce’s latest research.]]></description>
            <pubDate>Tue, 02 Jun 2026 12:42:40 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260602-13074.html</guid>
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