<?xml version="1.0" encoding="UTF-8" ?><rss version="2.0">
  <channel>
    <title>Global Market Intelligence &amp; Consulting | TrendForce</title>
    <link>https://www.trendforce.com</link>
    <description>TrendForce offers hi-tech industry research reports, including market bulletins, industry analysis and price trends, helping businesses tackle global challenges</description>
    <language>en-us</language>
    <lastBuildDate>Mon, 12 Oct 2026 23:08:30 +0800</lastBuildDate>
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            <title>Six Leading Suppliers Bet on VCSEL NPO; VCSEL Demand Projected to Reach 650 Million Units by 2031, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20261008-13260.html</link>
            <description><![CDATA[TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO). This technology is favored for its low power usage, easier maintenance, and a mature supply chain. Major companies like Lumentum, Furukawa Electric, Coherent, Broadcom, ams OSRAM, and HiSilicon are investing heavily in R&amp;D.]]></description>
            <pubDate>Thu, 08 Oct 2026 14:01:38 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20261008-13260.html</guid>
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            <title>AI Server Demand Sustains Memory Contract Price Increases in 4Q26, While Consumer-Side Pressure Persists, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260930-13258.html</link>
            <description><![CDATA[TrendForce’s latest memory industry research reveals that DRAM suppliers continue to prioritize advanced-process capacity for high-performance server products in 4Q26, keeping the overall market undersupplied. However, the pace of contract price increases is expected to moderate, with conventional DRAM prices projected to rise 10–15% QoQ.]]></description>
            <pubDate>Wed, 30 Sep 2026 15:52:15 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260930-13258.html</guid>
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            <title>HBM Supply Constraints Persist, 2027 Price Outlook Revised Upward with Blended ASP Forecast to Rise 121% YoY, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260929-13255.html</link>
            <description><![CDATA[TrendForce’s latest research reveals that continued expansion in AI server demand is keeping HBM and conventional DRAM in competition for limited advanced-process and wafer capacity. Meanwhile, yields and output for next-generation products will take time to ramp, keeping memory supply tight through 2027.]]></description>
            <pubDate>Tue, 29 Sep 2026 16:03:54 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260929-13255.html</guid>
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            <title>Japanese and Korean MLCC Makers Cut Consumer Supply to Focus on AI, Chinese Suppliers Enter Global Brand Qualification, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260924-13252.html</link>
            <description><![CDATA[According to TrendForce, the MLCC industry is experiencing a structural shift as AI demand continues to displace traditional markets. Leading Japanese and Korean suppliers are increasingly reducing their supply of consumer-oriented MLCCs and reallocating capacity to AI-related applications. This change is opening doors for Chinese suppliers, many of whom are now undergoing MLCC qualification with global brands such as Dell, HP, ASUS, and Acer.]]></description>
            <pubDate>Thu, 24 Sep 2026 10:48:07 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260924-13252.html</guid>
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            <title>DRAM Module Revenue Surges 59% YoY in 2025 as Crowding-Out Effect Constrains Chip Supply and Drives Prices Higher, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260922-13249.html</link>
            <description><![CDATA[According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong 59% YoY. Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive growth. This marked a significant acceleration from the 7% growth recorded in 2024.]]></description>
            <pubDate>Tue, 22 Sep 2026 13:38:23 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260922-13249.html</guid>
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            <title>Stronger North American Demand to Keep Enterprise SSD Prices on an Upward Trend in 4Q26, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260921-13246.html</link>
            <description><![CDATA[U.S. CSPs have recently upgraded their enterprise SSD demand forecasts over the past two weeks, according to TrendForce’s research. This shift is mainly driven by major CSPs speeding up deployments and expanding enterprise SSD use across more applications. Notably, this demand increase isn&#039;t confined to high-performance TLC products; QLC products, known for their superior cost efficiency and capacity, have become a significant growth catalyst.]]></description>
            <pubDate>Mon, 21 Sep 2026 13:46:21 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260921-13246.html</guid>
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            <title>AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260918-13241.html</link>
            <description><![CDATA[TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging. Although TSMC’s CoWoS-L faces competition from Intel’s EMIB-T, its advantages in technology maturity and yield are expected to keep it the mainstream packaging solution for AI chips through 2028.]]></description>
            <pubDate>Fri, 18 Sep 2026 17:09:41 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260918-13241.html</guid>
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            <title>Global Power Demand Capacity for Data Centers Expected to Rise 31% YoY in 2026; Grid Supply Gap to Widen in 2028, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260916-13237.html</link>
            <description><![CDATA[TrendForce’s latest AI server industry research reports that CSPs are accelerating infrastructure deployments to meet surging demand for AI applications. TrendForce estimates that global data center power demand capacity will reach 161 GW in 2026, up approximately 31% YoY. AI servers will be the primary driver of this growth, accounting for an estimated 33.4% of total demand capacity.]]></description>
            <pubDate>Wed, 16 Sep 2026 15:03:37 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260916-13237.html</guid>
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            <title>NOR Flash Price Trends Diverge in 2H26, with High-Capacity Products Poised for 90–110% Increases, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260914-13235.html</link>
            <description><![CDATA[TrendForce’s latest memory industry research indicates that the NOR Flash market is undergoing its most significant structural shift in supply and demand in nearly a decade. AI-related products are absorbing a substantial share of production capacity, leaving suppliers limited room to increase NOR Flash bit output even as demand for high-end applications continues to grow.]]></description>
            <pubDate>Mon, 14 Sep 2026 14:32:11 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260914-13235.html</guid>
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            <title>Top 10 Global Fabless IC Design Houses Post 73% YoY Revenue Growth in 2Q26; AMD Breaks into Top Three, Says TrendForce</title>
            <link>https://www.trendforce.com/presscenter/news/20260911-13231.html</link>
            <description><![CDATA[According to TrendForce’s latest IC design industry research, expanding AI applications continued to drive demand for GPUs, CPUs, ASICs, and interconnect products. Consequently, combined revenue of the world’s top 10 fabless IC design companies surged 73% YoY to more than US$141.45 billion in 2Q26.]]></description>
            <pubDate>Fri, 11 Sep 2026 14:29:35 +0800</pubDate>
            <guid>https://www.trendforce.com/presscenter/news/20260911-13231.html</guid>
        </item>
      </channel>
</rss>