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keyword:Jian-Hong Lin6 result(s)

Press Releases
AI Applications to Propel Revenue from Semiconductor Chip Sales Worldwide at a CAGR of 3.1% in 2018~2022 Period, Says TrendForce

2017/09/07

Semiconductors

This year, numerous sections of the IT supply chain including IC, IP development, EDA and OS have rolled out next-generation products and platforms for applications related to artificial intelligence (AI) According to market intelligence firm TrendForce, AI will create new market opportunities as well as upgrading the fabrication process for semiconductor manufacturers With AI becoming a major growth contributor, TrendForce forecasts that the global revenue from semiconductor chip sales will grow at a CAGR of 31% from 2018 to 2022 “AI influences the development of semiconductor sector in two ways: creating demand for new type of technologies and improving the product fabrication process,” said Jian-Hong Lin, research manager of TrendForce AI-related demand has spurred the arrival of new solutions in markets ranging from sensors, hardware accelerators, digital storage units and telecommunication services The establishment of AI-based services has also led to simultaneous upgrading of network infrastructure, data centers and server systems worldwide Furthermore, AI-related applications are also driving the average semiconductor content per box for various end devices Market arrivals of new IC solutions for the emerging applications, together with rising ASPs of mainstream IC products, have been bolstering the revenues of semiconductor makers An AI-related application that is witnessing fast-growing semiconductor demand is the automotive market As car makers invest resources into developing advanced driver assistance systems and electric vehicles, there is an influx of new sensors and controller components that seek to fulfill their specification needs Another emerging market for new semiconductor products is smart home solutions, which include voiced-based virtual personal assistants based on AI systems Besides these relatively new application markets, innovations in mainstream consumer electronic products continue to sustain semiconductor demand In the case of smartphones, specifications of mobile SoCs have been raised to allow new features such as biometric recognition and to achieve better performances (in terms of computing power, storage, data transfer and etc) The global top three smartphone brands and major suppliers of mobile SoCs all have offered hard- and software products including AI accelerators ICs and application development kits AI is also being introduced into semiconductor fabrication as part of the transformation of manufacturing under the concept of Industry 40 With the help of new production models powered by AI systems, semiconductor manufacturers are redefining their efficiency benchmarks for their production capacity plans The availability of data and the pace of digitalization are going to influence heavily on the competitiveness of individual manufacturers as early as 2018 The adoption of AI will also move the competition among the major chip producing regions (such as Taiwan, South Korea, the US and China) to a new phase The semiconductor supply chains within the respective regions will have specific challenges and opportunities on account of their own abilities to work under the AI-driven manufacturing framework TrendForce will hold its IT Industry Forecast for 2018 on the 29th of this September in Room 201 of National Taiwan University Hospital (NTUH) International Convention Center, located at No 2, Xuzhou Road, Zhongzheng District 101, Taipei City For more details on this event, please visit: http://seminartrendforcecom/TRI/AnnualForecast2017/TW/english/ or contact us via telephone or email

Press Releases
Automotive Has Become the Second Largest Application Market for Power Transistors, Says TrendForce

2017/06/07

Emerging Technologies / Semiconductors / Telecommunications

TrendForce’s latest research on the automotive electronics market finds that government policies worldwide to reduce carbon emissions have facilitated faster adoption of ICT-based solutions within the automotive industry According to TrendForce’s analysis, the global average value of analog ICs and power transistors for power management will come to US$209 per vehicle in 2017, an increase of 11% from US$188 in 2016 Furthermore, the automotive industry is projected to account for 23% of the total worldwide demand for power transistors this year Automotive has become the second largest application for power transistors, while the industrial application is the leading source of market demand for the product “Countries have adopted stricter standards for carbon emissions and air pollutants generated by vehicles,” said TrendForce research manager Jian-Hong Lin “To comply with regulations, auto makers are making energy efficiency a priority in their vehicle designs” Lin also pointed out that automotive semiconductors have become especially critical for companies developing xEVs, which include battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs) A plug-in vehicle has an electric charging system to provide power, a power conversion system to convert DC to AC and DC to DC of another voltage, plus a power supply system to distribute AC and DC to secondary systems within the vehicle “Efficiency in AC/DC conversion and safety in power management are two key elements in the regulatory standards that xEV must meet before they are released to the market,” said Lin “Therefore, specifications and performances of semiconductor components used in xEVs are very important” Demand for analog ICs and power transistors is expanding as xEV batteries grow in capacity and deliver electricity in higher voltages Lin pointed out unlike a smartphone, which needs only one power management IC (PMIC), a xEV due to safety requirements have numerous PMICs spread across its subsystems to maintain voltage levels as well as neutralizing static charges and signal interferences  Lin added: “Power management occurs just as electricity is trasmitted from the charging station and stored into the vehicle’s battery Further conversions of currents and reduction of voltages take place in the vehicle’s primary inverter, secondary inverter and DC/DC converter Therefore, PMICs have a major role in every subsystem of a xEV” Semiconductor components for power management include application-specific MCUs, MOSFETs, IGBTs, driver ICs and ICs for the battery management system (BMS) Currently, the main suppliers of these components are globally recognized automotive electronics companies such as Infineon, Renesas, STMicroelectronics and Texas Instruments As xEV batteries grow in capacity and deliver electricity in higher voltages, the demand for analog ICs and power transistors – whether for conversion or circuit protection – is expected to rise Looking at the global power transistor market by applications, the automotive segment will account for 23% of the market for 2017, up from 22% in 2016 TrendForce further forecasts that the automotive’s share of the market will reach 26% in 2021 This year, automotive is set to become the second largest application market for power transistors IDMs from Europe, Japan and the US may pass on a portion of their automotive electronics orders to Taiwanse foundries Taiwan’s semiconductor industry currently is working to expand its role in the automotive ICs and power transistor markets IDMs in Europe and Japan and the US may contract out the manufacturing of some of their automotive products due to cost considerations Taiwanese foundries such as TSMC and UMC are likely to be the leading candidate suppliers because they already have experience in producing automotive chips At present, Taiwan-based Vanguard International Semiconductor Corporation (VIS) is making IGBT products for Infineon While IGBT orders going to VIS are still in limited amount, the situation may change as the market penetration of xEVs rises Also, IGBT products are the mainstream in the power semiconductor category, so the demand for them is expected to go up, thus providing additional orders for VIS or other Taiwanese foundries China’s IC companies are laying the groundwork for a vertically integrated supply chain that can provide automotive products While most other digital ICs are able to continue to shrink in size following Moore’s Law, power transistors are encountering physical limits to further down-scaling There are also limited options of materials that power transistors can use to work under high voltages and to raise conversion efficiency At the same time, traditional silicon-based PMICs do not fit the specifications standards for the latest generation of driver safety and assistance systems Overcoming these bottlenecks requires further advances in semiconductor materials Hence, silicon carbide (SiC) and gallium nitride (GaN) are two semiconducting compounds are have the been the focus of development in the field of power semiconductors China now accounts for over 30% of the new vehicle sales worldwide, and its government actively supports the development of the domestic xEV industry With xEVs, Chinese car brands may have a chance to establish a greater presence on the international market Likewise, China has placed great importance on the domestic research of SiC and GaN components for power semiconductors and is also supporting the construction of fabs that supply these products Currently, there are several 6-inch wafer fabs in the country that is being upgraded to produce SiC and GaN components Also, major Chinese cities such as Xiamen and Quanzhou are also investing to build their local and vertically integrated supply chains for power electronics devices These planned industry clusters would contain manufacturers of wafer substrates, epi-wafers and chips It remains to be seen if Chinese semiconductor companies can change the competitive landscape of the automotive electronics market that is dominated by European, US and Japanese enterprises

Press Releases
China Further Fortifies Its Semiconductor Sector With Formation of High-End Chip Alliance, TrendForce Reports

2016/08/08

Consumer Electronics / Semiconductors

With the government’s backing, key enterprises in China’s semiconductor sector have just established a “high-end chip alliance” that fosters the formation of a vertically integrated industry ecosystem on a national scale The founding 27 members of this alliance include Tsinghua Unigroup, Yangtze River Storage Technology, SMIC, Huawei, ZTE and China Academy of Telecommunication Research (a branch of the country’s Ministry of Industry and Information Technology, or MIIT) “This alliance of government, academia and industry aims to create a complete ecosystem for domestic semiconductor manufacturers, said Jian-Hong Lin, research manager of TrendForce “If successful, the alliance will create a chip industry chain starting from chip architecture to chip production, operation systems, devices, platforms and finally to the IT service market In sum, this move is another indication of China’s ambition to transform itself from a major manufacturing country by export volume to a global manufacturing leader in terms of product quality Lin added: “The mission of China’s high-end chip alliance is to develop highly localized and vertically integrated relationships among industry players The ecosystem they built will be exclusively for domestic manufacturers and design houses This approach differs from the development of Taiwan’s semiconductor sector, where participants are highly specialized in their own fields and actively seek partnerships on the global market The Chinese expect their development strategy to be advantageous because there are currently few innovations in the chip industry in terms of product development Under this situation, vertical integration within the national context drives the division of labor and technological progress Moreover, vertical integration generates demand and expands the market and applications for semiconductor solutions” Lin also sees the formation of China’s high-end chip alliance as another warning to Taiwan’s semiconductor sector: “Taiwanese semiconductor companies cannot survive on just the demand from the domestic market and compatriot electronics brands This is especially true for the local IC design houses Their long-term growth will depend discovering new sources of demand and application needs in the international market Still, China currently is the largest market and has the largest client base for Taiwanese IC design houses Whether Taiwanese IC industry is allowed to form effective joint ventures or strategic partnerships with the Chinese counterpart is an issue that Taiwan’s government and technology enterprises need to address after the establishment of the high-end chip alliance in China” Furthermore, this Chinese industry alliance is not simply a team headed by the government to promote the purchase of domestically made semiconductor components “It will take time to understand the full implication of the cooperation between academia and industry,” said Lin “The high-end chip alliance could become an important platform for application development To reach that goal, however, requires the Chinese semiconductor sector to overcome several challenges” According to Lin, the high-end chip alliance will have to help remove several hurdles to speed up vertical integration and basic R&D: 1 Every company has to look after its operations, so the alliance has to find common grounds for cooperation Lin first pointed out that cooperation among Chinese semiconductor and technology companies is difficult to realize: “For instance, Chinese chip makers Spreadtrum and RDA Microelectronics are still operating independently even though they have been acquired by Tsinghua Unigroup Consolidating resources of two subsidiaries within a company is hard, but creating cross-industry alliances are even more challenging Spreadtrum and Huawei’s IC subsidiary HiSilicon, for example, have developed chip products based on the 16nm process technology Major Chinese chip manufacturer SMIC, on the other hand, produces on a less advanced process technology Spreadtrum and HiSilicon therefore will not be able to pursue the most advanced technology when working with SMIC Similarly, SMIC has to make adjustments to work with domestic equipment and material suppliers that have yet to catch up to its level of technological maturity Hence, the high-end chip alliance needs to set goals and incentives for the various industry participants as to make concrete progress” 2 Development roadmap for the industry has to be well paced in order properly channel the collective motivation and efforts Effective teamwork furthermore involves concrete, step-by-step plans Once chip-related IPs have been developed, their introductions into different applications, such as PCs, smartphones and IoT devices, must be carefully selected and prioritized To create significant benefits for the entire Chinese semiconductor sector, the high-end chip alliance needs to draw up a clear and comprehensive industry roadmap Otherwise, its members will be without coordination and pursue their own agendas 3 Achieving chip self-sufficiency fulfills a national ambition but engaging with the rest of the global semiconductor sector is just as important Lin said: “IC companies compete on an international level, so China’s semiconductor sector needs international resources to accelerate its development Recently, China has been active in seeking membership in international organizations related to semiconductor trades For example, the position of chairman of the board of directors for Global Semiconductor Association (GSA) is currently held by Dr Leo Li, Spreadtrum’s chairman and CEO Also, C-Sky Microsystem and Huawei became board members of Embedded Microprocessor Benchmark Consortium (EEMBC) earlier this year These events are all important milestones of progress for China’s semiconductor sector

Press Releases
TrendForce Forecasts China’s Flash Memory Capacity to Reach 590,000 Wafer Pieces by 2020 Due to Efforts from Major Semiconductor Manufacturers

2016/04/25

Semiconductors

Chinese semiconductor companies are in the midst of building a globally competitive NAND Flash industry and have accelerated their investments and deal-making in the related component and product chains XMC is expanding its fab capacity, while Unisplendour Guoxin (formerly known as Tongfang Guoxin) has also increased its investments in NAND Flash production Along with activities from domestic semiconductor companies, major international manufacturers such as Samsung and Intel likewise are building up new NAND Flash capacity in China Global market research firm TrendForce estimates that China’s domestic Flash memory capacity will reach 590,000 wafer pieces per month by 2020, a nearly sevenfold increase from 2015 According to TrendForce’s analysis, the global NAND Flash bit supply is expected to grow by at least 47% annually on average from 2012 to 2016 During the same period, bit demand in the worldwide NAND Flash consumer market will also increase by an average rate of 46% every year These projections indicate that the NAND Flash industry will continue to grow rapidly Jian-Hong Lin, TrendForce research manager, said that Chinese semiconductor companies are developing the manufacturing of Flash memory wafers under the country’s policy goal of becoming self-sufficient in the production of memory ICs Lin also noted that there are four main approaches that the Chinese can take to break into the NAND Flash market These are improving the manufacturing cost structure, exploiting the demand for 3D-NAND, expanding into emerging markets and attracting foreign investments in local memory production 1 Improving the manufacturing cost structure: Price is still the main consideration in the consumer market, so managing the manufacturing structure will be crucial for the Chinese memory makers They can offer lower-priced NAND Flash products by using various financial methods, such as adjusting annual depreciation rates, leasing land and equipment and obtaining government tax refunds 2 Exploiting 3D-NAND demand: Major international suppliers of Flash memory have been slow to move forward with their technology migrations after the adoption of the 2x-nm node technology because shrinking the manufacturing process no longer brings significant cost advantages Currently, 3D-NAND is seen by memory makers as another major innovation in cost-cutting Lin said the transition from the planar (2D) to the 3D-NAND structure will require expertise from other technology fields If the Chinese semiconductor companies managed to successfully bring together the talents and the necessary intellectual properties, they could catch up to the larger international memory suppliers in the 3D-NAND Flash market 3 Finding opportunities in the emerging markets: China’s new economic initiative, known as “The Belt and Road” (B&R), benefits domestic industries that are tapping into the demand of the neighboring emerging markets The Chinese NAND Flash industry therefore will have additional unique strengths under the B&R framework, such as being supported by the state’s resources as well as its influence abroad 4 Getting investments from foreign semiconductor companies: International semiconductor manufacturers have been quick to build a presence in China, as they are attracted to the country’s huge market and abundant workforce These foreign companies have trained lots of local industry talents that domestic manufacturers can also use to help run their fabs Hence, the manufacturing capacity established by the international manufacturers would lower the development barriers for Chinese Flash memory makers

Press Releases
Global Semiconductor Sales for 2016 to Sink 0.6% Annually to US$329 Billion, According to TrendForce

2015/12/08

Semiconductors

Due to the slowing growth of the mobile communication industry, global market research firm TrendForce projects that the total revenue from sales of semiconductors worldwide will grow by a mere 09% year on year in 2015, a sharp plunge from the 105% year-on-year growth in 2014 Looking forward to 2016, the decline in the sales of memory products will become steeper and drag down the total semiconductor sales revenue As a result, semiconductor revenue growth is projected to become negative and slide slightly by 06% year on year, amounting to around US$329 billion  According to TrendForce Research Manager Jian-Hong Lin, the semiconductor sector will witness the following trends in 2016: (1) The decline in PC shipments will moderate and ASPs of mobile devices will recover Weak PC demand and the rising share of PCs carrying CPU/GPU SoC products this year have led to a contraction in the overall revenue from PC-related IC products However, the overall inventory level of PCs has been through corrections this year and this will help stabilize CPU sales next year, narrowing the fluctuation of average sales prices (ASPs) for CPU products While growth in the mobile device market has slowed this year, the share of devices carrying application processors (APs) made on the 16/14nm processes is expected to grow The price decline in APs for mid-range and high-end devices will decelerate going into 2016 TrendForce estimates that the global sales revenue of digital IC chips will decline by 14% year on year in 2015 and see a lesser drop of 07% year on year in 2016 (2) Growth in analog IC and OSD markets will continue with automotive components and high-resolution CIS’s becoming demand drivers In 2016, automobile shipments worldwide is expected to grow 5% year on year, and the average cost of analog IC components for each vehicle will rise as well Consequently, the share of automotive application in the overall analog IC market will grow from the estimated 28% in 2015 to the forecast of 30% in 2016 The automotive application will also drive the overall analog IC sales, which will grow 35% year on year in 2016 Rising demand from high-resolution CMOS imaging sensors (CIS’s) and automotive components will continue to benefit the optoelectronics, sensors/actuators and discretes (OSD) market TrendForce estimates the annual increase in the global OSD sales revenue to reach 44% for 2016 (3) Memory IC market will remain as an oligopoly and see sales revenue decline next year due to oversupply Global sales revenue of memory IC products are projected to grow just 18% year on year in 2015 owing to supply outstripping demand in the end market Both DRAM and NAND Flash sales will slide next year and cause the total memory IC sales revenue to fall 7% year on year, based on TrendForce’s latest analysis Compared with other product types (ie digital IC, analog IC and OSD), the memory IC segment is expected to suffer the steepest price decline next year and will be the main culprit behind the 06% year-on-year drop in next year’s global semiconductor revenue Lin added that there will be two major forces guiding the semiconductor sector in 2016: (1) With the rise of vertical markets, systems companies will be a new force to be reckon with in the IC market In addition to IDMs and fabless IC design houses, systems companies are gradually becoming important players in IC manufacturing For instance, Apple now accounts for nearly 10% of the global foundry revenue, and this encourages other smartphone vendors to develop their own IC components Data center operators are considering this option as well ARM, for example, has collaborated with several major data center operators with various degrees of progress The advent of the Internet of Things will demand systems companies to assert greater control over the vertical markets that they are developing Hence, systems companies will also exert greater influence over IC manufacturing and have greater control over IC products used in their businesses (2) Regional markets will push for local manufacturing but trade agreements will determine the geographical distribution of semiconductor production China has been aggressively conducting investment, merger and acquisition deals with foreign semiconductor companies since its government released “Guidelines to Promote IC Industry Development” last year Some of the landmark deals made by the Chinese this year included the acquisitions of STATS ChipPAC and OmniVision Moreover, the state-backed Chinese technology conglomerate Tsinghua Unigroup has been actively investing in the NAND Flash industry Besides China, India and Indonesia have also heavily promoted local manufacturing and their governments are developing massive support programs to fulfill their respective policy agendas On the other hand, the increasing number of free trade agreements signed by countries around the world will weaken tariff barriers and diminish the effects of national industrial policies on international markets TrendForce concludes that the combination of these factors will cause shifts in the geographical distribution of semiconductor manufacturing

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