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Panel Prices Will Remain High in 2Q20 Due to the Effect of the Furnace Explosion at AGC Fine Techno Korea, Says TrendForce

2 February 2021

AGC Fine Techno Korea, which is a glass substrate manufacturing plant owned by AGC and located in the South Korean city of Gumi, suffered a furnace explosion that also led to injuries of plant personnel on January 29. TrendForce’s latest investigation projects that this incident will affect no more than 1% of the total global supply of glass substrates for display panels. However, demand is rising across the panel market. At this sensitive moment, any event that affects the supply of panel components could exert significant influence on panel prices. In the second half of 2020, glass substrate supplier NEG (that is based in Japan) experienced issues that constrained the supply and thereby fueled the rise in panel prices. TrendForce does not rule out the possibility that this latest incident will also further bolster panel prices to some degree.

Automotive Market Set to Recover in 2021 with Yearly Sales of 84 Million Vehicles, While 12-inch Fab Capacities for Automotive Semiconductor Undergoes Most Severe Shortage, Says TrendForce

28 January 2021

Not only did automotive market take a downward turn starting in 2018, but the severe impact of the COVID-19 pandemic in 2020 also led to noticeably insufficient procurement activities from major automotive module suppliers, according to TrendForce’s latest investigations. However, as the automotive market is currently set to make a recovery, TrendForce expects yearly vehicle sales to increase from 77 million units in 2020 to 84 million units in 2021. At the same time, the rising popularity of autonomous, connected, and electric vehicles is likely to lead to a massive consumption of various semiconductor components. Even so, since most manufacturers in the automotive supply chain currently possess a relatively low inventory, due to their sluggish procurement activities last year in light of weak demand, the discrepancies in the inventory levels of various automotive components, along with the resultant manufacturing bottleneck, have substantially impaired automakers’ capacity utilization rates and, subsequently, vehicle shipments.

Mini LED Chip Revenue Likely to Reach US$270 Million in 2021 as Battle Over Mini LED Backlight TV Specs Takes Place, Says TrendForce

25 January 2021

As various TV manufacturers such as Samsung, LG, and TCL announced their new models equipped with Mini LED backlights at CES 2021, TrendForce’s 2021 Mini LED New Backlight Display Trend Analysis report shows that total Mini LED chip revenue from Mini LED backlight TVs to potentially reach US$270 million in 2021, as manufacturers gradually overcome technological bottlenecks and lower their overall manufacturing costs, according to TrendForce’s latest investigations.

Shortage Caused by Explosive Growth in Mini LED Demand to Result in 5-10% Price Hike for LED Chips, Says TrendForce

19 January 2021

While major OEMs such as Apple and Samsung prepare to release their new notebook computers, tablets, and TVs that are fully equipped with Mini LED backlights this year, various companies in the LED supply chain began procuring Mini LED chips ahead of time in 4Q20, leading to an explosive demand growth for these chips, which in turn crowded out the LED suppliers’ production capacities for other mainstream LED chips, according to TrendForce’s latest investigations. Given this structure-wide shortage of LED chips, certain LED chip suppliers have been raising the quotes on chips supplied to non-core clients and chips with relatively low gross margins. This price hike is estimated at about 5-10%.

TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce

13 January 2021

Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H21, Intel’s mid-range and high-end CPUs are projected to enter mass production using TSMC’s 3nm node in 2H22.


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